{"product_id":"ieej-efm08019","title":"Deep Silicon Etch for TSV application - for increased performance and productivity","description":"\u003cp\u003e\u003cstrong\u003eカテゴリ: \u003c\/strong\u003e研究会(論文単位)\u003c\/p\u003e\u003cp\u003e\u003cstrong\u003e論文No: \u003c\/strong\u003eEFM08019\u003c\/p\u003e\u003cp\u003e\u003cstrong\u003eグループ名: \u003c\/strong\u003e【C】電子・情報・システム部門　電子材料研究会\u003c\/p\u003e\u003cp\u003e\u003cstrong\u003e発行日: \u003c\/strong\u003e2008\/05\/19\u003c\/p\u003e\u003cp\u003e\u003cstrong\u003eタイトル(英語): \u003c\/strong\u003eDeep Silicon Etch for TSV application - for increased performance and productivity\u003c\/p\u003e\u003cp\u003e\u003cstrong\u003e著者名: \u003c\/strong\u003eSharma Pamarthy(Applied Materials Inc.),Jon Farr(Applied Materials Inc.),Khalid Sirajuddin(Applied Materials Inc.),Ajay Kumar(Applied Materials Inc.)\u003c\/p\u003e\u003cp\u003e\u003cstrong\u003e著者名(英語): \u003c\/strong\u003eSharma Pamarthy(Applied Materials Inc.),Jon Farr(Applied Materials Inc.),Khalid Sirajuddin(Applied Materials Inc.),Ajay Kumar(Applied Materials Inc.)\u003c\/p\u003e\u003cp\u003e\u003cstrong\u003eキーワード: \u003c\/strong\u003eThrough Silicon Via(TSV)|Via|Deep Silicon Etch|Time multiplexed gas modulation(TMGM)|DPS|Via First|Via Last|CD(Critical Dimension)|Inductive Plasma|Scallop|Through Silicon Via(TSV)|Via|Deep Silicon Etch|Time multiplexed gas modulation(TMGM)|DPS|Via Firs\u003c\/p\u003e\u003cp\u003e\u003cstrong\u003e原稿種別: \u003c\/strong\u003e日本語\u003c\/p\u003e\u003cp\u003e\u003cstrong\u003ePDFファイルサイズ: \u003c\/strong\u003e944 Kバイト\u003c\/p\u003e","brand":"IEEJ-PDF","offers":[{"title":"PDFダウンロード（一般価格330円\/会員価格220円） \/ A4 \/ 7","offer_id":46362105217263,"sku":"IEEJ-EFM08019-PDF","price":330.0,"currency_code":"JPY","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0718\/9512\/2159\/files\/IEEJ-PDF_e6f1c503-08c3-4313-a835-2d6be678b32d.png?v=1743620139","url":"https:\/\/ieej.bookpark.ne.jp\/products\/ieej-efm08019","provider":"電気学会 電子図書館","version":"1.0","type":"link"}