Simplification of Dielectric Breakdown Test Using a Multi-Element Electrode System and its Weibull Analysis

カテゴリ: 研究会(論文単位)

論文No: DEI25073,EWC25011

グループ名: 【A】基礎・材料・共通部門 誘電・絶縁材料/【B】電力・エネルギー部門 電線・ケ－ブル合同研究会

発行日: 2025/03/04

タイトル(英語): Simplification of Dielectric Breakdown Test Using a Multi-Element Electrode System and its Weibull Analysis

著者名: Zahra Shafira(Toyohashi University of Technology),Kawashima Tomohiro(Toyohashi University of Technology),Murakami Yoshinobu(Toyohashi University of Technology),Hozumi Naohiro(Hozumi Measurement Lab / Nagoya Industrial Science Research Institute)

著者名(英語): Shafira Zahra(Toyohashi University of Technology),Tomohiro Kawashima(Toyohashi University of Technology),Yoshinobu Murakami(Toyohashi University of Technology),Naohiro Hozumi(Hozumi Measurement Lab / Nagoya Industrial Science Research Institute)

キーワード: Dielectric|Polyimide|Breakdown test|Partial discharge|Weibull Analysis|Statistical distribution|Dielectric|Polyimide|Breakdown test|Partial discharge|Weibull Analysis|Statistical distribution

要約(日本語): Partial discharge testing of insulation film is a valuable technique for evaluating insulation properties. Various statistical distributions, such as Weibull and exponential functions, are often employed to interpret the dielectric breakdown (BD) strength

要約(英語): Partial discharge testing of insulation film is a valuable technique for evaluating insulation properties. Various statistical distributions, such as Weibull and exponential functions, are often employed to interpret the dielectric breakdown (BD) strength data. This study aimed to determine a suitable statistical distribution for analyzing the dielectric BD data of 25mm thick polyimide (PI) material by using a sphere-plate electrode system with a single element and multi element as high-voltage electrodes. The dielectric BD strength data are compared and evaluated by using Weibull statistics, as Weibull distribution has been widely used and effectively evaluate the film quality.

本誌: 2025年3月7日誘電・絶縁材料/電線・ケ－ブル合同研究会

本誌掲載ページ: 45-48 p

原稿種別: 英語

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