Thermal Stability of Additive to Improve Dielectric Strength of XLPE Insulation

カテゴリ: 部門大会

論文No: 297

グループ名: 【B】平成17年電気学会電力・エネルギー部門大会講演論文集

発行日: 2005/08/10

タイトル(英語): Thermal Stability of Additive to Improve Dielectric Strength of XLPE Insulation

著者名: Sang-Jin Lee (LS電線),Bok-Hee Youn (LS電線),Sung-Ik Shim (LS電線),Se-Eun Park (LS電線),Dae-Hee Cho (LS電線)

著者名(英語): Sang-Jin Lee(LS Cable Ltd),Bok-Hee Youn(LS Cable Ltd),Sung-Ik Shim(LS Cable Ltd),Se-Eun Park(LS Cable Ltd),Dae-Hee Cho(LS Cable Ltd)

キーワード: Interfacial strength|additive|diffusion interface

要約(日本語): Abstract - With the aim of developing XLPE insulation for extra high voltage cable, we investigated the morphology of cross-linked polyethylene. We used several kinds of base materials and additives, and controlled curing condition and amount of additives. The effect of additive addition on morphology of XLPE such as lamellar density, orientation and additive layer were analyzed using TEM analysis. For evaluation of breakdown strength of XLPE insulation with additives and base materials, the mold-type XLPE specimens were made and evaluated with Weibull plot parameters, and compared with morphological characteristics. Thermal stability of additive was investigated using accelerated aging instrument. Additive diffusion layer before and after thermal aging was analyzed using FT-IR analysis and changes of microstructure were analyzed using synchrotron and TEM analysis. Evaluation of breakdown strength of XLPE specimen after thermal aging was also investigated.

PDFファイルサイズ: 1,938 Kバイト