High Speed Transmission Characteristics of RDL interposer for Next Generation Computing Application

カテゴリ: 部門大会

論文No: TC16-2

グループ名: 【C】2022年電気学会電子・情報・システム部門大会

発行日: 2022/08/24

タイトル(英語): High Speed Transmission Characteristics of RDL interposer for Next Generation Computing Application

著者名: Kuramochi Satoru（大日本印刷）

著者名(英語): Satoru Kuramochi (Dai Nippon Printing Co.,ltd)

キーワード: Redistribution layers|High speed signal transmision|low loss tangentlow loss tangent

要約(日本語): Interposers for system in package will became more and more important for advanced electronic systems. As the industry moves toward NGC (Next Generation Computing) for huge data transmission with low power consumption. The major engineering requirements for NGC application are high speed data transmission, precision manufacturing and low cost. On the 2.5D heterogenous package structure, key technology is fine wiring connected with heterogenous chips. The fine wires needed high speed transmission. This paper presents first the demonstration of RDL interposers with fine pitch firing and low loss dielectric layers. High speed transmission characteristics for RDL interposer modeled with eye diagram. Excellent transmission obtained on fine pitch trace area using low loss tangent dielectrics.