Effect of mixing of convective layer of wet plating on plating quality: role of vorticity for Rotating Cylinder Electrode, Hull Cell experiment, and jet mixing for wet plating using PIV Flow field study

カテゴリ: 部門大会

論文No: OS3-3

グループ名: 【C】平成27年電気学会電子・情報・システム部門大会講演論文集

発行日: 2015/08/27

タイトル(英語): Effect of mixing of convective layer of wet plating on plating quality: role of vorticity for Rotating Cylinder Electrode, Hull Cell experiment, and jet mixing for wet plating using PIV Flow field study

著者名: Toshinosuke Akutsu(Kanto Gakuin University),Motoi Tokorozawa(Kanto Gakuin University),Gou Ichimura(Kanto Gakuin University)

著者名(英語): Toshinosuke Akutsu(Kanto Gakuin University),Motoi Tokorozawa(Kanto Gakuin University),Gou Ichimura(Kanto Gakuin University)

キーワード: PIV|Fluid Dynamical study

要約(日本語): Mixing of convective layer of wet plating greatly influence on the plating quality. In order to investigate the role of vorticity in mixing process, series of experimental studies were conducted using Rotating cylinder electrode mixing, air mixing using hull cell chamber, and jet mixing for wet plating. Dynamic PIV was utilized to further investigate the possible role of convective layer of general wet plating. Strong vorticity activity is expected at the region of strong mixing and considered to be a strong indicator of such process.

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