電析ニッケルとNi-P合金めっき皮膜におよぼす各種緩衝剤の影響

カテゴリ: 部門大会

論文No: OS3-4

グループ名: 【C】平成27年電気学会電子・情報・システム部門大会講演論文集

発行日: 2015/08/27

タイトル(英語): Effect of various buffering agents on the electrodeposited nickel and Ni-P alloy plating film

著者名: Masayoshi Terada(Rough Neck),Keita Sato(Kanto Gakuin University),Yoshiaki Ouya(Kanto Gakuin University),Tsugito Yamashita(Kanto Gakuin University)

著者名(英語): Masayoshi Terada(Rough Neck),Keita Sato(Kanto Gakuin University),Yoshiaki Ouya(Kanto Gakuin University),Tsugito Yamashita(Kanto Gakuin University)

キーワード: ニッケルめっき|緩衝剤|Nickel plating|Buffer agent

要約(日本語): Investigated Boron-Free alternative buffer agents for nickel plating.
The electrochemical properties of electrodeposited nickel film with various buffer agents such as Phthalic acid bath, Potassium hydrogen phthalate bath and Malic acid bath were structurally analyzed and evaluated, and compared with those of Citric acid and Watts bath. And Electrolytic Ni-P alloy plating bath using above buffer agents Ni-P alloy plating film was prepared to examine the effects also.
The evaluation and analysis of various buffer agents in nickel bath containing carboxyl group buffers was confirmed that it has suppressing effect to electro deposition. It also showed electro crystallization inhibitory effect and possibility of refining the crystal.

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