3D Hetero-Integration Technologies for Innovative Convergence Systems

カテゴリ: 部門大会

論文No: TC7-3

グループ名: 【C】平成27年電気学会電子・情報・システム部門大会講演論文集

発行日: 2015/08/27

タイトル(英語): 3D Hetero-Integration Technologies for Innovative Convergence Systems

著者名: 李 康旭(東北大学)

著者名(英語): Kangwook Lee(Tohoku University)

要約(日本語): 3-D hetero-integration have many benefits such as increased multi-functionality, increased performance, increased data bandwidth, reduced power, small form factor, reduced packaging volume, because it vertically stacks multiple materials, technologies, and functional components into one stacked chip. It can create many potential applications such as innovative convergence systems because it allows the assembling various kinds of functional blocks. However, hetero-integration of different functional devices has many technical challenges owing to various types of size, thickness, and substrate of different functional devices. This paper introduce 3-D hetero-integration technologies for multi-functional hetero-integrated convergence systems developed by Tohoku Univ./GINTI.

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