Effects of Boron Nitride Filler Loading to Epoxy Resins on Thermal Conductivity and Dielectric Breakdown Strength

カテゴリ: 研究会(論文単位)

論文No: DEI11028

グループ名: 【A】基礎・材料・共通部門 誘電・絶縁材料研究会

発行日: 2011/01/28

タイトル(英語): Effects of Boron Nitride Filler Loading to Epoxy Resins on Thermal Conductivity and Dielectric Breakdown Strength

著者名: WANG Zengbin(Waseda University),IIZUKA Tomonori(Waseda University),KOZAKO Masahiro(Kyushu Institute of Technology),OHKI Yoshimichi(Waseda University),TANAKA Toshikatsu(Waseda University)

著者名(英語): Zengbin WANG(Waseda University),Tomonori IIZUKA(Waseda University),Masahiro KOZAKO(Kyushu Institute of Technology),Yoshimichi OHKI(Waseda University),Toshikatsu TANAKA(Waseda University)

キーワード: Epoxy/Composite|micro BN|Nano Slica - Micro BN|Thermal conductivity|Dielctric breakdown strength|Filler surface modification

要約(日本語): Epoxy/micro BN (boron nitride) composites and epoxy/nano silica micro BN composites were prepared to investigate their thermal conductivity and dielectric breakdown (BD) strength. It was clarified that BD strength is almost independent of micro filler content up to 40 wt%, while the thermal conductivity increases to a certain degree. Thermal conductivity is increased further to 3 W/mK by loading up to 60 vol%, but BD strength is reduced. Appropriate filler surface modification can help improve both of thermal conductivity and BD strength.

要約(英語): Epoxy/micro BN (boron nitride) composites and epoxy/nano silica micro BN composites were prepared to investigate their thermal conductivity and dielectric breakdown (BD) strength. It was clarified that BD strength is almost independent of micro filler content up to 40 wt%, while the thermal conductivity increases to a certain degree. Thermal conductivity is increased further to 3 W/mK by loading up to 60 vol%, but BD strength is reduced. Appropriate filler surface modification can help improve both of thermal conductivity and BD strength.

原稿種別: 日本語

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