空間電荷分布測定による2層誘電体中に進展したエレクトロケミカルマイグレーションの検出と信号の数値解析

カテゴリ: 論文誌(論文単位)

グループ名: 【A】基礎・材料・共通部門

発行日: 2011/09/01

タイトル(英語): Detection of Electrochemical Migration Grown in a Two-layered Dielectric by the Pulsed Electroacoustic Method and Numerical Analysis of the Signals

著者名: 浅川　洋貴（早稲田大学），夏井　正嗣（早稲田大学），田中　祀捷（早稲田大学），大木　義路（早稲田大学），前野　恭（情報通信研究機構），岡本　健次（富士電機ホールディングス（株））

著者名(英語): Hiroki Asakawa (Waseda University), Masashi Natsui (Waseda University), Toshikatsu Tanaka (Waseda University), Yoshimichi Ohki (Waseda University), Takashi Maeno (National Institute of Information and Communications Technology), Kenji Okamoto (Fuji Electric Holdings Co., Ltd.)

キーワード: プリント配線板，紙/フェノール樹脂複合材，エポキシ樹脂，エレクトロケミカルマイグレーション，空間電荷，パルス静電応力法　　printed wiring board，paper/phenol-resin composite，epoxy resin，electrochemical migration，space charge，pulsed electroacoustic method

要約(英語): Electrochemical migration growth along the thickness direction in a two-layered dielectric, consisting of an Al cathode, paper/phenol-resin composite, epoxy resin, and a Cu anode that simulates a laminated structure of a printed wiring board, was detected by the pulsed electroacoustic (PEA) method. The PEA signals obtained were analyzed using a numerical model on the generation and propagation of acoustic waves. Accumulation of positive charge appears in front of the Cu anode of the sample, in which the growth of electrochemical migration was observed by SEM-EDS. At the same time, the signal due to negative charge at the interface between the resin and the composite decreases significantly. This is ascribable to the progress of electrochemical migration in the thickness direction. The numerical analysis done by assuming that the conductivity of the epoxy resin layer near the anode was increased gives a good agreement with the PEA spectra. As for the charge on the anode, the PEA signal appears at the correct position when the anode material is semi-conductive polymer, while it appears as if the anode were inside the real anode when the material is Cu. In order to solve this puzzle, numerical calculations were carried out by the finite difference method. As a result, it has become clear that the discontinuity in the acoustic impedance between the epoxy resin and Cu electrode is responsible.

本誌: 電気学会論文誌A（基礎・材料・共通部門誌） Vol.131 No.9 （2011） 特集：自然災害軽減のための電磁界技術

本誌掲載ページ: 771-777 p

原稿種別: 論文／日本語

電子版へのリンク: https://www.jstage.jst.go.jp/article/ieejfms/131/9/131_9_771/_article/-char/ja/