Development of Simulation Techniques of Mechanical Strength of Nanocomposite Insulating Materials

カテゴリ: 論文誌(論文単位)

グループ名: 【A】基礎・材料・共通部門

発行日: 2013/03/01

タイトル(英語): Development of Simulation Techniques of Mechanical Strength of Nanocomposite Insulating Materials

著者名: Akihiro Sano (Hitachi Ltd., Hitachi Research Lab.), Atsushi Ohtake (Hitachi Ltd., Hitachi Research Lab.), Kinya Kobayashi (Hitachi Ltd., Hitachi Research Lab.), Hironori Matsumoto (Hitachi Ltd., Hitachi Research Lab.)

著者名(英語): Akihiro Sano (Hitachi Ltd., Hitachi Research Lab.), Atsushi Ohtake (Hitachi Ltd., Hitachi Research Lab.), Kinya Kobayashi (Hitachi Ltd., Hitachi Research Lab.), Hironori Matsumoto (Hitachi Ltd., Hitachi Research Lab.)

キーワード: nanocomposite resin，simulation，molecular orbital method，coarse grained molecular dynamics

要約(英語): Mechanical strength simulation techniques for nanocomposite resins have been developed. Coarse grained molecular dynamics are used to calculate the nanofiller distribution in resin and the stress-strain curve (S-S curve) of nanocomposite resin. A molecular orbital method based on density functional theory in which the electrical fields from a large region (μm-mm) of surrounding resin are taken into consideration to obtain the inter-molecular forces for molecular dynamics. In addition, present simulations were applied to silica/epoxy nanocomposite resins and the following results were obtained. (1) While hydrophilic silica is uniformly distributed, hydrophobic silica forms a network in epoxy. These results agree with an experimental observation using scanning electron microscope. (2) The maximum level of stress of the calculated S-S curves of resin with hydrophobic silica is greater than that with hydrophilic silica. This result qualitatively agrees with the fracture-toughness measured by using a three-point bending test.

本誌: 電気学会論文誌A（基礎・材料・共通部門誌） Vol.133 No.3 （2013） 特集：2011 International Symposium on Electrical Insulating Materials

本誌掲載ページ: 81-84 p

原稿種別: 論文／英語

電子版へのリンク: https://www.jstage.jst.go.jp/article/ieejfms/133/3/133_81/_article/-char/ja/