Stabilization of Impedance Matching System using RF Transformer

カテゴリ: 論文誌(論文単位)

グループ名: 【A】基礎・材料・共通部門

発行日: 2016/07/01

タイトル(英語): Stabilization of Impedance Matching System using RF Transformer

著者名: Kazuhiro Sugimoto (Functional Control System, Graduate School of Engineering and Science, Shibaura Institute of Technology), Mineo Watakabe (Corporate Technology Center, Sunsay Generic Co., Ltd.), Masayuki Okuno (Corporate Technology Center, Sunsay Generi

著者名(英語): Kazuhiro Sugimoto (Functional Control System, Graduate School of Engineering and Science, Shibaura Institute of Technology), Mineo Watakabe (Corporate Technology Center, Sunsay Generic Co., Ltd.), Masayuki Okuno (Corporate Technology Center, Sunsay Generic Co., Ltd.), Tetsuya Homma (Functional Control System, Graduate School of Engineering and Science, Shibaura Institute of Technology)

キーワード: inductively coupled plasma，impedance matching，RF transformers

要約(英語): We have investigated a new dry ashing system for manufacturing of semiconductor devices. For this purpose, we have proposed a plasma system using RF transformer, which is essential to dry ashing, in order to maintain the plasma excitation. This RF transformer can achieve a balanced connection of inductive coil. This system also can improve the ashing uniformity, resulting in high capability for various plasma processing. From the measurement of antenna potential, the deviation of etching rate for balanced connection was reduced to 35%, as compared to that for the unbalanced connection, resulting in improvement of uniformity. By employing an impedance conversion method using RF transformer, the incident signal power can be supplied even though the 25 times higher load impedance than conventional plasma systems. As for the T-type impedance matching using RF transformer, the matching time was reduced to 0.2 s from 8 s for conventional L-type impedance matching system. Wide range impedance matching can be achieved by using T-type impedance matching system. It was confirmed that this system can achieve a stable plasma processing and reduction of ashing process step number, as well as reduction of power consumption and environmental load.

本誌: 電気学会論文誌A（基礎・材料・共通部門誌） Vol.136 No.7 （2016）

本誌掲載ページ: 404-408 p

原稿種別: 論文／英語

電子版へのリンク: https://www.jstage.jst.go.jp/article/ieejfms/136/7/136_404/_article/-char/ja/