減圧誘導加熱分解法によるPCB液状絶縁油の分解処理システム

カテゴリ: 論文誌(論文単位)

グループ名: 【A】基礎・材料・共通部門

発行日: 2019/02/01

タイトル(英語): Decomposition Processing System of the PCB Liquid Insulator by the Vacuum Induction Heating Decomposition Method

著者名: 向山　佳秀（湘南工科大学），神佐　青芳（湘南工科大学），長澤　可也（湘南工科大学），神佐　健（日本ベルツ（株））

著者名(英語): Yoshihide Mukoyama (Shonan Institute of Technology), Haruka Kansa (Shonan Institute of Technology), Kaya Nagasawa (Shonan Institute of Technology), Ken Kansa (Belz Japan Corporation)

キーワード: PCBs，分解処理，減圧誘導加熱分解法，ダイオキシン，絶縁油，熱分解　　PCBs，decomposition system，vacuum induction heating decomposition method，dioxins，electric insulation oil，thermal decomposition

要約(英語): In this paper, a new decomposition method are developed for PCBs by high temperature pyrolysis method without using chemical substance such as metallic sodium. Pyrolysis in this decomposition system is by the following process. The thermal decomposition part is shielded from the outside by the quartz glass tube, and the interior is decompressed by the vacuum pump. The metal heating element in the glass tube is induction heated to 1,400 [℃] by the coil outside the glass tube. PCBs vaporized by heating from the evaporating part are decomposed thermally by passing through the heating element heated at 1,400 [℃]. Since the PCBs are decomposed in an oxygen-free atmosphere, generation of dioxin is also suppressed. In the experiment, tens of gram of PCBs was vaporized, and a decomposition rate of 99.9999 [%] was obtained. A basic mechanism of new PCB processing technology was established with low cost and no generation of dioxin.

本誌: 電気学会論文誌A（基礎・材料・共通部門誌） Vol.139 No.2 （2019） 特集：2017 International Symposium on Electrical Insulating Materials

本誌掲載ページ: 119-129 p

原稿種別: 論文／日本語

電子版へのリンク: https://www.jstage.jst.go.jp/article/ieejfms/139/2/139_119/_article/-char/ja/