多相空気流を用いた薄板の非接触搬送法

カテゴリ: 論文誌(論文単位)

グループ名: 【C】電子・情報・システム部門

発行日: 2017/09/01

タイトル(英語): Conveyance Method of Thin Plate by Using Multiple-phase Air Flow

著者名: 古谷　克司（豊田工業大学工学部），中村　祐介（豊田工業大学大学院工学研究科），瓜田　明（豊田工業大学工学部）

著者名(英語): Katsushi Furutani (Faculty of Engineering, Toyota Technological Institute), Yusuke Nakamura (Graduate School of Engineering, Toyota Technological Institute), Akira Urita (Faculty of Engineering, Toyota Technological Institute)

キーワード: 非接触，搬送，多相，薄板，空気流　　non-contact，transfer，multiple-phase，thin plate，air flow

要約(英語): This paper deals with a transfer method for a thin plate by levitating with multiphase air flow. Non-contact transfer methods are required for glass plates and semiconductor wafers in order to keep them clean. In the proposed method, a thin plate was slightly levitated with a small inclination by blowing and sucking air from orifice restrictors, and airflow was blown against the lower side of the plate so that the driving force was generated. The plate was continuously carried by shifting the air flow pattern in accordance with the plate position. 48 air flow slots were arranged with intervals of 15 mm. The velocity of a plate with dimensions of 90 mm × 100 mm × 2 mm and a weight of 139 g was almost linearly increased at an acceleration of 15 mm/s2 and reached 50 mm/s after driving for 3 s. The levitated height was 0.13 and 0.28 mm at the lower and higher sides at air pressures of the positive and negative restrictors of +7.0 and less than -3.0 kPa, respectively. In the case of an initial velocity of 60 mm/s, the plate was turned in reverse after moving for 100 mm. The plate can move reciprocally by reversing the air flow pattern.

本誌: 電気学会論文誌C（電子・情報・システム部門誌） Vol.137 No.9 （2017） 特集：知能メカトロニクス分野と連携する知覚情報技術

本誌掲載ページ: 1145-1152 p

原稿種別: 論文／日本語

電子版へのリンク: https://www.jstage.jst.go.jp/article/ieejeiss/137/9/137_1145/_article/-char/ja/