ラム波の非線形性を利用したシリコンウェーハのマイクロクラック検査に関する基礎的検討

カテゴリ: 論文誌(論文単位)

グループ名: 【C】電子・情報・システム部門

発行日: 2018/12/01

タイトル(英語): Basic Study on Microcrack Inspection for Silicon Wafer using the Nonlinearity of Lamb Wave

著者名: 村田　頼信（和歌山大学システム工学部），西川　美沙都（和歌山大学大学院システム工学研究科），松田　正誉（和歌山大学大学院システム工学研究科）

著者名(英語): Yorinobu Murata (Faculty of Systems Engineering, Wakayama University), Misato Nishikawa (Graduate School of System Engineering, Wakayama University), Masataka Matsuda (Graduate School of System Engineering, Wakayama University)

キーワード: マイクロクラック，シリコンウェーハ，超音波非線形性，ラム波　　microcrack，silicon wafer，ultrasonic nonlinearity，lamb wave

要約(英語): In the process of manufacture of silicon wafers, it becomes a problem that microscopic defect called microcrack may occur in a wafer. It is difficult to detect by an image inspection using infrared or a usual ultrasonic inspection because the aperture of microcrack is closed. In this study, as a nondestructive testing for a silicon wafer, we paid attention to inspection method using the nonlinearity of ultrasonic wave. First, a system which detects microcracks by making ultrasonic wave propagate along the surface of a silicon wafer was constructed. However, the ultrasonic wave propagating in a silicon wafer was not identified, and the optimization of the system had been unsolved. Therefore, the propagation analysis of the ultrasonic wave was carried out. As the result, it was suggested that it is a Lamb wave. Finally, by using the characteristic of Lamb wave, it was demonstrated that the proposed inspection method was useful for not only the microcrack inspection which lengthened the propagation distance but also the microcrack inspection in the back surface.

本誌: 電気学会論文誌C（電子・情報・システム部門誌） Vol.138 No.12 （2018） 特集：電気・電子・情報関係学会東海支部連合大会

本誌掲載ページ: 1566-1572 p

原稿種別: 論文／日本語

電子版へのリンク: https://www.jstage.jst.go.jp/article/ieejeiss/138/12/138_1566/_article/-char/ja/