Electro-Thermo-Mechanical Analysis of High-Power Press-Pack Insulated Gate Bipolar Transistors under Various Mechanical Clamping Conditions
Electro-Thermo-Mechanical Analysis of High-Power Press-Pack Insulated Gate Bipolar Transistors under Various Mechanical Clamping Conditions
カテゴリ: 論文誌(論文単位)
グループ名: 【D】産業応用部門(英文)
発行日: 2014/05/01
タイトル(英語): Electro-Thermo-Mechanical Analysis of High-Power Press-Pack Insulated Gate Bipolar Transistors under Various Mechanical Clamping Conditions
著者名: Adrian Augustin Hasmasan (Department of Energy Technology, Aalborg University), Cristian Busca (Department of Energy Technology, Aalborg University), Remus Teodorescu (Department of Energy Technology, Aalborg University), Lars Helle (Vestas wind systems A
著者名(英語): Adrian Augustin Hasmasan (Department of Energy Technology, Aalborg University), Cristian Busca (Department of Energy Technology, Aalborg University), Remus Teodorescu (Department of Energy Technology, Aalborg University), Lars Helle (Vestas wind systems A/S), Frede Blaabjerg (Department of Energy Technology, Aalborg University)
キーワード: press-pack IGBT,mechanical modeling,clamping force,thermal modeling,power loss modeling,reliability
要約(英語): With the continuously increasing demand for energy and the limited supply of fossil fuels, renewable power sources are becoming ever more important. Knowing that future energy demand will grow, manufacturers are increasing the size of new wind turbines (WTs) in order to reduce the cost of energy production. The reliability of the components has a large impact on the overall cost of a WT, and press-pack (PP) insulated gate bipolar transistors (IGBTs) could be a good solution for future multi-megawatt WTs because of advantages like high power density and reliability. When used in power converters, PP IGBTs are stacked together with other components in a clamping mechanism in order to ensure electrical and thermal contact. Incorrect mechanical clamping of PP IGBTs has a negative impact on their reliability and consequently on the reliability of the WT. In this study the impact of mechanical clamping conditions on the static thermal distribution among chips in PP IGBTs is investigated.
本誌: IEEJ Journal of Industry Applications Vol.3 No.3 (2014)
本誌掲載ページ: 192-197 p
原稿種別: 論文/英語
電子版へのリンク: https://www.jstage.jst.go.jp/article/ieejjia/3/3/3_192/_article/-char/ja/
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