シリコンチップの電子的・熱的・機械的特性を活かした両面放熱パワーモジュール開発の経緯

カテゴリ: 論文誌(論文単位)

グループ名: 【D】産業応用部門

発行日: 2020/03/01

タイトル(英語): Development History of the Double-sided Cooling Power Module Considering Electronic, Thermal and Mechanical Characteristics of Silicon Power Semiconductor Chips

著者名: 戸倉　規仁（愛知県岡崎市），牧野　友厚

著者名(英語): Norihito Tokura (Okazaki city, Aichi), Tomoatsu Makino

キーワード: パワーカード，両面放熱パワーモジュール，両面ハンダ付け，FS-IGBT，積層冷却器　　Power-Card，double-sided cooling power module，double-sided soldering，FS-IGBT，Stacked-Cooler

要約(英語): Since smaller thermal-resistance design is indispensable for automotive IGBT modules, the double-sided cooling power module and stacked cooler have been developed. However, it has not known that the FS-IGBT played an extremely important role in exquisite combination of. Therefore, we have reviewed the bottlenecks from the viewpoint of the power semiconductor chips in the power module, named as “Power-Card”, followed by the basic functions the chips should have. Further, we have recognized that the paradigm shift from “Power semiconductor device first” to “Power module first” has strongly pushed forward realization.

本誌: 電気学会論文誌D（産業応用部門誌） Vol.140 No.3 （2020） 特集：半導体電力変換研究会

本誌掲載ページ: 148-157 p

原稿種別: 論文／日本語

電子版へのリンク: https://www.jstage.jst.go.jp/article/ieejias/140/3/140_148/_article/-char/ja/