Mission-Profile-Based Testing Scheme for Sub-Modules in Modular Multilevel Converter

カテゴリ: 論文誌(論文単位)

グループ名: 【D】産業応用部門（英文）

発行日: 2020/05/01

タイトル(英語): Mission-Profile-Based Testing Scheme for Sub-Modules in Modular Multilevel Converter

著者名: Yunxiao Yang (Department of Electrical Engineering, Shanghai Jiao Tong University), Weiyao Wang (Department of Electrical Engineering, Shanghai Jiao Tong University), Ke Ma (Department of Electrical Engineering, Shanghai Jiao Tong University)

著者名(英語): Yunxiao Yang (Department of Electrical Engineering, Shanghai Jiao Tong University), Weiyao Wang (Department of Electrical Engineering, Shanghai Jiao Tong University), Ke Ma (Department of Electrical Engineering, Shanghai Jiao Tong University)

キーワード: mission profile emulator，modular multilevel converter，sub-modules，carrier phase-shift pulse width modulation

要約(英語): Modular multilevel converter (MMC) has been widely used in medium/high-voltage direct current transmission, motor drive, and renewable energy power generation. The reliability requirements of the MMC system, which is composed of numerous sub-modules (SMs) as building blocks, are getting crucial. However, the testing for reliability of SMs in a full MMC system is time-consuming and costly. In this paper, a mission profile emulator for SMs in the MMC system is therefore focused; by using this mission profile emulator, the SMs can be tested individually without building a full MMC system. Simulation results have shown that arm current and capacitor voltage of the SM under test agree well with the SM in a complete MMC system. A scaled-down experimental platform is built and experimental results have proved the validity of this emulator.

本誌: IEEJ Journal of Industry Applications Vol.9 No.3 （2020） Special Issue on “SPC-Power Electronics and Its Applications”

本誌掲載ページ: 219-226 p

原稿種別: 論文／英語

電子版へのリンク: https://www.jstage.jst.go.jp/article/ieejjia/9/3/9_219/_article/-char/ja/