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High-Speed and Low-Latency Transmission by Millimeter-Wave Digital Wireless System for Si-IGBT/SiC-MOSFET Driver Control

High-Speed and Low-Latency Transmission by Millimeter-Wave Digital Wireless System for Si-IGBT/SiC-MOSFET Driver Control

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カテゴリ: 論文誌(論文単位)

グループ名: 【D】産業応用部門(英文)

発行日: 2023/05/01

タイトル(英語): High-Speed and Low-Latency Transmission by Millimeter-Wave Digital Wireless System for Si-IGBT/SiC-MOSFET Driver Control

著者名: Koji Akita (Corporate Research & Development center, Toshiba Corporation), Yukako Tsutsumi (Corporate Research & Development center, Toshiba Corporation), Hiroyuki Kitagawa (Corporate Research & Development center, Toshiba Corporation), Kentaro Suzuki (In

著者名(英語): Koji Akita (Corporate Research & Development center, Toshiba Corporation), Yukako Tsutsumi (Corporate Research & Development center, Toshiba Corporation), Hiroyuki Kitagawa (Corporate Research & Development center, Toshiba Corporation), Kentaro Suzuki (Infrastructure Systems Research and Development Center, Toshiba Infrastructure Systems & Solutions Corporation), Ryosuke Saito (Infrastructure Systems Research and Development Center, Toshiba Infrastructure Systems & Solutions Corporation), Yoshihiro Tawada (Power Electronics Systems Division, Toshiba Mitsubishi-Electric Industrial Systems Corporation)

キーワード: wireless,driver control,Si-IGBT,SiC-MOSFET,millimeter-wave

要約(英語): Wireless transmission of gate control signals is expected to improve insulation performance and design flexibility. This paper proposes high-speed and low-latency transmission by millimeter wave digital wireless system for Si-IGBT/SiC-MOSFET driver control. High-speed and low-latency transmission is realized by continuous transmission using the millimeter wave radio. Solutions for handling errors and reliability are also presented. The effectiveness of the proposed system is demonstrated by evaluating the transmission latency, the effect of wireless errors using a real-time simulator, and its connection to an actual inverter.

本誌: IEEJ Journal of Industry Applications Vol.12 No.3 (2023) Special Issue on “IPEC-Himeji 2022”

本誌掲載ページ: 351-356 p

原稿種別: 論文/英語

電子版へのリンク: https://www.jstage.jst.go.jp/article/ieejjia/12/3/12_22007552/_article/-char/ja/

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