射出成形における樹脂材料のサブミクロン構造への充填挙動

カテゴリ: 論文誌(論文単位)

グループ名: 【E】センサ・マイクロマシン部門

発行日: 2013/04/01

タイトル(英語): Filling Behavior of Polymer Material into Sub-μm Structure in Injection Molding Process

著者名: 吉村　千里（ブラザー工業（株）），細川　裕之（（独）産業技術総合研究所），下島　康嗣（（独）産業技術総合研究所），糸魚川　文広（国立大学法人名古屋工業大学）

著者名(英語): Chisato Yoshimura (Brother Industries, LTD.), Hiroyuki Hosokawa (Materials Research Institute for Sustainable Development National Institute of Advanced Industrial Science and Technology), Koji Shimojima (Materials Research Institute for Sustainable Development National Institute of Advanced Industrial Science and Technology), Fumihiro Itoigawa (National University Corporation Nagoya Institute of Technology)

キーワード: マイクロニードルアレイ，射出成形，表面エネルギー，摩擦，濡れ性　　Microneedle Array，Injection molding，Surface energy，Friction，Wettability

要約(英語): The moldability of sub-μm pillar injection molding was investigated by using polycarbonate with four kinds of die material; SKD11, WC/Co, Ni and DLC coated on SKD11. It was also investigated by using Cyclic olefin polymer (COP) with SKD11 and DLC coated on SKD11. The cross-sectional profiles of molded object were precisely measured by a critical dimension FE-SEM. In the case of injecting polycarbonate with a SKD11 or Ni die, a tip of molded object had a paraboloid shape which may be caused by extrusion with large friction between the die materials and polycarbonate. In the case of injecting polycarbonate with a WC/Co or DLC die, a frustum shape with plateau due to low friction was exhibited in spite of large wettability between WC/Co and the melted polycarbonate. It may be considered that a multitude of small void on the WC/Co surface caused the moldability with low friction. On the other hand, The moldability was insensitive with molding conditions in COP with SKD11 or DLC coated on SKD11 die.

本誌: 電気学会論文誌E（センサ・マイクロマシン部門誌） Vol.133 No.4 （2013）

本誌掲載ページ: 105-111 p

原稿種別: 論文／日本語

電子版へのリンク: https://www.jstage.jst.go.jp/article/ieejsmas/133/4/133_105/_article/-char/ja/