MEMS構造に損傷を与えないパーティクル除去方法

カテゴリ: 論文誌(論文単位)

グループ名: 【E】センサ・マイクロマシン部門

発行日: 2013/05/01

タイトル(英語): Particle Removal without Causing Damage to MEMS Structure

著者名: 平野　栄樹（東北大学　大学院工学研究科），Mahmoud Rasly（東北大学　大学院工学研究科），Neelam Kaushik（東北大学　原子分子材料科学高等研究機構），江刺　正喜（東北大学　原子分子材料科学高等研究機構），田中　秀治（東北大学　大学院工学研究科）

著者名(英語): Hideki Hirano (Graduate school of Engineering, Tohoku University), Mahmoud Rasly (Graduate school of Engineering, Tohoku University), Neelam Kaushik (WPI-AIMR, Tohoku University), Masayoshi Esashi (WPI-AIMR, Tohoku University), Shuji Tanaka (Graduate school of Engineering, Tohoku University)

キーワード: パーティクル汚染，構造破壊，メガソニック洗浄，二流体噴霧洗浄，超音波洗浄，ゼータ電位　　Particulate contamination，Structural damage，Megasonic cleaning，2-fluid jet spray cleaning，Ultrasonic cleaning，Zeta-potential

要約(英語): Particulate contamination on a wafer is the most crucial problem for wafer bonding, which is one of key process technologies for MEMS (Micro Electro Mechanical Systems). To address the problem, physical assists such as megasonic agitation is generally employed, but acoustic agitation often causes damage to fragile MEMS structures. In this study, several cleaning methods were compared in terms of both particle removal efficiency (PRE) and damage to the fragile MEMS structures. Conventional immersion type cleaning or ultrasonic cleaning cannot remove small particles efficiently, while atomized water jet spray (2-fluid jet spray) cleaning with pressurized nitrogen gas can effectively remove particles without damage to cantilever structures in a short time. Megasonic cleaning with de-ionized water can remove the particles, but it damages the cantilever structures at a same time. In contrast, megasonic cleaning with surfactant dissolved water or diluted ammonia/H2O2 water can effectively remove particles even at a low physical energy, which causes no damage to the structures.

本誌: 電気学会論文誌E（センサ・マイクロマシン部門誌） Vol.133 No.5 （2013） 特集：第29回「センサ・マイクロマシンと応用システム」シンポジウム受賞論文特集

本誌掲載ページ: 157-163 p

原稿種別: 論文／日本語

電子版へのリンク: https://www.jstage.jst.go.jp/article/ieejsmas/133/5/133_157/_article/-char/ja/