Low-Stress Epitaxial Polysilicon Process for Micromirror Devices
Low-Stress Epitaxial Polysilicon Process for Micromirror Devices
カテゴリ: 論文誌(論文単位)
グループ名: 【E】センサ・マイクロマシン部門
発行日: 2013/06/01
タイトル(英語): Low-Stress Epitaxial Polysilicon Process for Micromirror Devices
著者名: Yukio Suzuki (Micro System Integration Center, Tohoku University), Kentaro Totsu (Micro System Integration Center, Tohoku University), Hiraku Watanabe (Micro System Integration Center, Tohoku University), Masaaki Moriyama (Micro System Integration Center,
著者名(英語): Yukio Suzuki (Micro System Integration Center, Tohoku University), Kentaro Totsu (Micro System Integration Center, Tohoku University), Hiraku Watanabe (Micro System Integration Center, Tohoku University), Masaaki Moriyama (Micro System Integration Center, Tohoku University), Masayoshi Esashi (World Premier International Research Center Advanced Institute for Materials Research, Tohoku University), Shuji Tanaka (Department of Nanomechanics, Graduate School of Engineering, Tohoku University)
キーワード: Epi-poly-Si,Micromirror,Low-stress,Stress gradient,Isolation trench
要約(英語): This paper reports key process technologies for the application of epitaxial polysilicon (epi-poly-Si) to scanning micromirrors, including low-stress epi-poly-Si deposition, the chemical mechanical polishing (CMP) of epi-poly-Si and the fabrication of trench isolations in the epi-poly-Si film. Epi-poly-Si thicker than 20 μm was deposited at a rate of 300 nm/min using an atmospheric pressure epitaxial reactor. The residual film stress was 57.2±1.4 MPa (compressive), and the stress gradient was 1.41±0.84 MPa/μm (more tensile toward the surface) for an as-deposited 21 μm thick film. The average surface roughness Ra was initially 202±48 nm, but improved to 10 nm by 10 min CMP. The stress gradient after CMP was as small as -0.30±0.1 MPa/μm. This leads to only negligible bending of cantilevers, e.g. 0.5 μm for a 1000 μm long cantilever. Isolation trenches refilled with poly-Si was fabricated in epi-poly-Si. A stepwise design to minimize voids in the refilled trench was demonstrated.
本誌: 電気学会論文誌E(センサ・マイクロマシン部門誌) Vol.133 No.6 (2013) 特集:匂い・香りのセンシングおよび再現技術の新展開
本誌掲載ページ: 223-228 p
原稿種別: 論文/英語
電子版へのリンク: https://www.jstage.jst.go.jp/article/ieejsmas/133/6/133_223/_article/-char/ja/
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