Chip-Level Microassembly of XYZ-Microstage with Large Displacements

カテゴリ: 論文誌(論文単位)

グループ名: 【E】センサ・マイクロマシン部門

発行日: 2015/06/01

タイトル(英語): Chip-Level Microassembly of XYZ-Microstage with Large Displacements

著者名: Gaopeng Xue (Graduate School of Engineering, Tohoku University), Masaya Toda (Graduate School of Engineering, Tohoku University), Takahito Ono (Graduate School of Engineering, Tohoku University)

著者名(英語): Gaopeng Xue (Graduate School of Engineering, Tohoku University), Masaya Toda (Graduate School of Engineering, Tohoku University), Takahito Ono (Graduate School of Engineering, Tohoku University)

キーワード: Chip-level microassembly technology,Electrical connections,XYZ-microstage,Large displacements

要約(英語): This letter reports a novel chip-level microassembly technology to construct an XYZ-microstage with large displacements into X-, Y-, Z-directions. The main parts of the XYZ-microstage, consisting of a comb-drive XY-microstage, two comb-drive Z-microstages and a bottom silicon base substrate, are assembled together by using micro manipulators. Small conductive mechanical springs are used to realize the electrical connections between XY-microstage and Z-microstages. It is demonstrated that the fabricated XYZ-microstage based on microassembly technology can achieve displacements of 25.2 μm in X direction, 20.4 μm in Y direction and 58.5 μm in Z direction, respectively.

本誌: 電気学会論文誌E（センサ・マイクロマシン部門誌） Vol.135 No.6 （2015） 特集：第31回「センサ・マイクロマシンと応用システム」シンポジウム受賞論文特集

本誌掲載ページ: 236-237 p

原稿種別: 研究開発レター／英語

電子版へのリンク: https://www.jstage.jst.go.jp/article/ieejsmas/135/6/135_236/_article/-char/ja/