Wireless Sensor Nodes with Ultra-low Power Consumption for Low-Frequency Vibration Monitoring
Wireless Sensor Nodes with Ultra-low Power Consumption for Low-Frequency Vibration Monitoring
カテゴリ: 論文誌(論文単位)
グループ名: 【E】センサ・マイクロマシン部門
発行日: 2015/09/01
タイトル(英語): Wireless Sensor Nodes with Ultra-low Power Consumption for Low-Frequency Vibration Monitoring
著者名: Jian Lu (Research Center for Ubiquitous MEMS and Micro Engineering (UMEMSME), National Institute of Advanced Industrial Science and Technology (AIST)), Lan Zhang (Research Center for Ubiquitous MEMS and Micro Engineering (UMEMSME), National Institute of A
著者名(英語): Jian Lu (Research Center for Ubiquitous MEMS and Micro Engineering (UMEMSME), National Institute of Advanced Industrial Science and Technology (AIST)), Lan Zhang (Research Center for Ubiquitous MEMS and Micro Engineering (UMEMSME), National Institute of Advanced Industrial Science and Technology (AIST)), Hironao Okada (Research Center for Ubiquitous MEMS and Micro Engineering (UMEMSME), National Institute of Advanced Industrial Science and Technology (AIST)), Toshihiro Itoh (Research Center for Ubiquitous MEMS and Micro Engineering (UMEMSME), National Institute of Advanced Industrial Science and Technology (AIST)), Takeshi Harada (NMEMS Technology Research Organization), Ryutaro Maeda (Research Center for Ubiquitous MEMS and Micro Engineering (UMEMSME), National Institute of Advanced Industrial Science and Technology (AIST))
キーワード: low-frequency vibration monitor,wireless sensor node,low power consumption,world smallest,analog switch,integration
要約(英語): System scaling down in the viewpoint of both electrical blocks and physical interconnection is essential to wireless sensor nodes for layout-free and maintenance-free ubiquitous applications in wireless sensor networks (WSN). In this work, a piezoresistive planar MEMS sensor with the sensitivity of 0.2~0.3 mV/V/g was developed for the monitoring of vibrations at low-frequency of a few Hz. To reduce power consumption of the system to the lowest limit as well as to reduce the quantity of electrical components, a fully-integrated low-power customized LSI with universal interface to sensors was designed and fabricated by using 0.18 μm 1.8V/3.3V 1P6M logic process for power management, data acquisition, data processing, and data transmission by RF signal. Power supply to the sensor can be managed by the customized LSI for reducing its power consumption. Output analog signal from the sensor can be obtained by the customized LSI through on-chip integrated amplifier and AD convertor. To reduce size of the system to the lowest limit, buried bump interconnection technology (B2itTM) was introduced for the integration of above customized LSI, MEMS sensor, crystal oscillator, and passive components into a 3D structure. Those technologies enable the production of the world smallest class wireless sensor nodes with ultra-low power consumption for low-frequency vibration monitoring, and for temperature and humidity measurement.
本誌: 電気学会論文誌E(センサ・マイクロマシン部門誌) Vol.135 No.9 (2015)
本誌掲載ページ: 355-360 p
原稿種別: 論文/英語
電子版へのリンク: https://www.jstage.jst.go.jp/article/ieejsmas/135/9/135_355/_article/-char/ja/
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