商品情報にスキップ
1 1

High Aspect Ratio SiO2 Pillar Structures Capable of the Integration of an Image Sensor for Application of Optical Modulator

High Aspect Ratio SiO2 Pillar Structures Capable of the Integration of an Image Sensor for Application of Optical Modulator

通常価格 ¥550 JPY
通常価格 セール価格 ¥550 JPY
セール 売り切れ
税込

カテゴリ: 論文誌(論文単位)

グループ名: 【E】センサ・マイクロマシン部門

発行日: 2016/02/01

タイトル(英語): High Aspect Ratio SiO2 Pillar Structures Capable of the Integration of an Image Sensor for Application of Optical Modulator

著者名: Nguyen Van Toan (Micro System Integration Center (μSIC), Tohoku University), Suguru Sangu (Core Technology Research & Development Center, Ricoh Institute of Future Technology), Takahito Ono (Graduate School of Engineering, Tohoku University)

著者名(英語): Nguyen Van Toan (Micro System Integration Center (μSIC), Tohoku University), Suguru Sangu (Core Technology Research & Development Center, Ricoh Institute of Future Technology), Takahito Ono (Graduate School of Engineering, Tohoku University)

キーワード: SiO2 pillars,reactive ion etching process,optical window,light transmittance,image sensor

要約(英語): This paper presents an optical window capable of the integration of an image sensor for the application of optical modulators. The optical window consists of high aspect ratio SiO2 pillars that can modulate the transmission light intensity by moving a liquid in and out of the spaces between pillars. The high aspect ratio SiO2 pillar structures are fabricated by reactive ion etching (RIE). SiO2 pillars together with smooth surfaces, vertical shapes (base angle ~89.5°) and high aspect ratio of 12 with a depth of 12 μm, diameter of 1 μm, and the pitch of two pillars of 2 μm have been achieved. An optical window with and without liquid penetration area integrated with an image sensor for an optical modulator has been successfully demonstrated. A high transmission modulation together with a large contrast have been observed of approximately 65% and 0.86 for cases with and without matching oil penetration, respectively.

本誌: 電気学会論文誌E(センサ・マイクロマシン部門誌) Vol.136 No.2 (2016)

本誌掲載ページ: 41-42 p

原稿種別: 研究開発レター/英語

電子版へのリンク: https://www.jstage.jst.go.jp/article/ieejsmas/136/2/136_41/_article/-char/ja/

販売タイプ
書籍サイズ
ページ数
詳細を表示する