Capacitive Micromachined Ultrasonic Transducer Packaging for Forward-looking Ultrasonic Endoscope using Low Temperature Co-fired Ceramic Side Via

カテゴリ: 論文誌(論文単位)

グループ名: 【E】センサ・マイクロマシン部門

発行日: 2016/12/01

タイトル(英語): Capacitive Micromachined Ultrasonic Transducer Packaging for Forward-looking Ultrasonic Endoscope using Low Temperature Co-fired Ceramic Side Via

著者名: Fikret Yildiz (Graduate School of Engineering, Tohoku University), Tadao Matsunaga (Micro System Integration Center, Tohoku University), Yoichi Haga (Graduate School of Engineering, Tohoku University/Graduate School of Biomedical Engineering, Tohoku Unive

著者名(英語): Fikret Yildiz (Graduate School of Engineering, Tohoku University), Tadao Matsunaga (Micro System Integration Center, Tohoku University), Yoichi Haga (Graduate School of Engineering, Tohoku University/Graduate School of Biomedical Engineering, Tohoku University)

キーワード: LTCC side via，CMUT packaging，ultrasonic endoscope，forward-looking intravascular ultrasound，fine needle aspiration

要約(英語): This paper reports part of a novel packaging method for a capacitive micromachined ultrasonic transducer (CMUT) based ultrasonic endoscope using low temperature co-fired ceramic (LTCC) side via architecture. An annular ring array CMUT device is designed and fabricated for packaging. LTCC is used as a prime wafer for CMUT fabrication and LTCC side via structure is achieved by hexagonal shape dicing of the fabricated CMUT device. A hexagonal shaped polyimide substrate mounted at the backside of the CMUT is used as a base layer for IC integration (flip-chip bonding) and also provides mechanical support to the CMUT. Cr/Au electrodes were patterned on the LTCC side via and polyimide substrate to achieve electrical connection between CMUT arrays and IC circuits. Au bonding pads were successfully completed on the polyimide substrate by electroplating for flip-chip bonding. Flip-chip mounting on the polyimide substrate is described and the electrical resistance of bumps is measured using the 4-probe method. The difference between the measured and calculated resistance is discussed. This method with the indirect connection of CMUT arrays and IC circuits has flexibility for high performance tube-shaped CMUT packaging with small diameters for intravascular imaging.

本誌: 電気学会論文誌E（センサ・マイクロマシン部門誌） Vol.136 No.12 （2016）

本誌掲載ページ: 515-521 p

原稿種別: 論文／英語

電子版へのリンク: https://www.jstage.jst.go.jp/article/ieejsmas/136/12/136_515/_article/-char/ja/