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Wireless Power Supply for All-in-one LTCC Packaged Sensor Nodes Applicable to Infrastructure Monitoring

Wireless Power Supply for All-in-one LTCC Packaged Sensor Nodes Applicable to Infrastructure Monitoring

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カテゴリ: 論文誌(論文単位)

グループ名: 【E】センサ・マイクロマシン部門

発行日: 2017/09/01

タイトル(英語): Wireless Power Supply for All-in-one LTCC Packaged Sensor Nodes Applicable to Infrastructure Monitoring

著者名: Jian Lu (Research Center for Ubiquitous MEMS and Micro Engineering (UMEMSME), National Institute of Advanced Industrial Science and Technology (AIST)), Lan Zhang (Research Center for Ubiquitous MEMS and Micro Engineering (UMEMSME), National Institute of A

著者名(英語): Jian Lu (Research Center for Ubiquitous MEMS and Micro Engineering (UMEMSME), National Institute of Advanced Industrial Science and Technology (AIST)), Lan Zhang (Research Center for Ubiquitous MEMS and Micro Engineering (UMEMSME), National Institute of Advanced Industrial Science and Technology (AIST)), Masao Arakawa (NMEMS Technology Research Organization), Takeshi Harada (NMEMS Technology Research Organization)

キーワード: wireless power transmission,RFID,all-in-one,ceramic package,trouble-shooting,infrastructure monitoring

要約(英語): Online monitoring of infrastructures attracts great interests in recent years because of the increasing of nature disasters and the aging of bridges, high-ways, buildings, etc. In road infrastructure monitoring system (RIMS) project, to ensure enough long lifetime, i.e. > 10 years, and low maintenance cost of the sensor nodes when deployed to wild field environments for infrastructure monitoring, an all-in-one ceramic package with stand-alone power source and wireless communication is under developing without any external physical interconnections. This paper reports the development and evaluation of a wireless power transmission module for power backup and rescue when built-in solar cell or other power source cannot supply sufficient energy. The results clearly revealed that efficiency of the wireless power transmission, as high as 73.2%, was achieved when the thickness of the ceramic package was 3 mm. Thanks to the impedance matching circuit, a 100 F lithium-ion capacitor (LIC) can be fully-charged within a few minutes by using above module. Moreover, a hybrid RFID chip was introduced as a data-recorder for trouble shooting, which is technically important for practical applications of above all-in-one sensor nodes for infrastructure monitoring.

本誌: 電気学会論文誌E(センサ・マイクロマシン部門誌) Vol.137 No.9 (2017)

本誌掲載ページ: 267-271 p

原稿種別: 論文/英語

電子版へのリンク: https://www.jstage.jst.go.jp/article/ieejsmas/137/9/137_267/_article/-char/ja/

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