減圧水蒸気プラズマによる酸化銅の還元
減圧水蒸気プラズマによる酸化銅の還元
カテゴリ: 論文誌(論文単位)
グループ名: 【E】センサ・マイクロマシン部門
発行日: 2019/07/01
タイトル(英語): Reduction of Copper Oxide by Water Vapor Plasma at Low Pressure
著者名: 寺井 弘和(サムコ(株)),岡藤 圭吾(サムコ(株)),田中 貴也(サムコ(株)),橋本 泰知(サムコ(株)),中野 博彦(サムコ(株)),辻 理(サムコ(株))
著者名(英語): Hirokazu Terai (Samco Inc.), Keigo Okafuji (Samco Inc.), Takaya Tanaka (Samco Inc.), Taichi Hashimoto (Samco Inc.), Hirohiko Nakano (Samco Inc.), Osamu Tsuji (Samco Inc.)
キーワード: 酸化銅,還元,水蒸気プラズマ,水素プラズマ,誘導期 Copper oxide,Reduction,Water vapor plasma (Aqua Plasma),Hydrogen plasma,Induction period
要約(英語): As a new and safe reduction method for copper oxide, we propose the use of water vapor plasma at low pressure instead of conventional hydrogen plasma. Although hydrogen plasma is the established method to reduce copper oxide at low temperature, hydrogen is flammable and requires safety equipment. In this study, oxidized copper film was treated with water vapor plasma and its reduction process was compared with hydrogen plasma's. Surface, cross-section structure and thickness of oxidized and reduced copper film were measured and analyzed by FE-SEM (Field Emission-Scanning Electron Microscope), FIB (Focused Ion Beam), XRD (X-Ray Diffraction) and XPS (X-ray Photoelectron Spectroscopy). Using water vapor plasma, oxidized copper film was reduced without any oxygen remaining. During the reduction process, induction period and S-shaped curve were observed to be the same as hydrogen plasma. Furthermore, the reduction rate of water vapor plasma was more than twice that of hydrogen plasma.
本誌: 電気学会論文誌E(センサ・マイクロマシン部門誌) Vol.139 No.7 (2019) 特集:第35回「センサ・マイクロマシンと応用システム」シンポジウム受賞論文
本誌掲載ページ: 157-162 p
原稿種別: 論文/日本語
電子版へのリンク: https://www.jstage.jst.go.jp/article/ieejsmas/139/7/139_157/_article/-char/ja/
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