Investigation of Shear Stress between Roll Interfaces in a High-accuracy Roll-Type Stamping Transfer System
Investigation of Shear Stress between Roll Interfaces in a High-accuracy Roll-Type Stamping Transfer System
カテゴリ: 論文誌(論文単位)
グループ名: 【E】センサ・マイクロマシン部門
発行日: 2020/04/01
タイトル(英語): Investigation of Shear Stress between Roll Interfaces in a High-accuracy Roll-Type Stamping Transfer System
著者名: Makoto Tokonami (Department of Applied Mechanics, Waseda University), Shunsuke Yamada (Research Organization for Nano & Life Innovation, Waseda University), Makoto Kashiwagi (Department of Chemistry and Biological Science, Aoyama Gakuin University), Eiji
著者名(英語): Makoto Tokonami (Department of Applied Mechanics, Waseda University), Shunsuke Yamada (Research Organization for Nano & Life Innovation, Waseda University), Makoto Kashiwagi (Department of Chemistry and Biological Science, Aoyama Gakuin University), Eiji Iwase (Department of Applied Mechanics, Waseda University)
キーワード: Stamping transfer,Flexible electronics,Stretchable Electronics,Micro-Electro-Mechanical-Systems (MEMS)
要約(英語): We investigated the influence of the shear force on a roll-type transfer technique developed to realize high transfer ratio and high positioning accuracy. Roll-type stamping transfer is a promising method for integrating solid-state devices on flexible substrates. However, the accuracy of the roll-type stamping transfer method is insufficient for tiny devices, such as Micro-Electro-Mechanical-Systems (MEMS) sensors, integrated circuits, and surface-mounting chips, because of the shear stress that occurs at the contact of the two rolls. In this work, the shear force was measured at various roll radii and rotational speeds. The results suggest that adjustments of the roll radius can reduce the shear stress to less than 10 kPa. The low shear stress improves the misalignment angle by 2 degrees, with a high roll rotational speed, which enables the development of a hybrid sensing system for flexible and rigid devices at a large-scale.
本誌: 電気学会論文誌E(センサ・マイクロマシン部門誌) Vol.140 No.4 (2020)
本誌掲載ページ: 79-83 p
原稿種別: 論文/英語
電子版へのリンク: https://www.jstage.jst.go.jp/article/ieejsmas/140/4/140_79/_article/-char/ja/
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