Design Integration Method of Vibration Sensor and Sensing Circuit with Zero-power Charge Transfer for Millimeter-sized Wireless Sensor Nodes

カテゴリ: 論文誌(論文単位)

グループ名: 【E】センサ・マイクロマシン部門

発行日: 2021/01/01

タイトル(英語): Design Integration Method of Vibration Sensor and Sensing Circuit with Zero-power Charge Transfer for Millimeter-sized Wireless Sensor Nodes

著者名: Toshishige Shimamura (NTT Device Innovation Center), Hiroki Morimura (NTT Device Innovation Center)

著者名(英語): Toshishige Shimamura (NTT Device Innovation Center), Hiroki Morimura (NTT Device Innovation Center)

キーワード: wireless sensor node，vibration sensing，low-power electronics，design integration

要約(英語): This paper describes a design integration method that simulates the sensing characteristics of a low-input-impedance sensing circuit combined with a sensor having a complexly structured vibration amplification mechanism (VAM). The sensing circuit that detects vibrations with zero power transforms acceleration to an electrical signal by transferring charges by utilizing the kinetic energy of the movable element in the sensor. The VAM adjusts the resonance frequency to within the target range of the vibration spectrum to obtain a sufficient signal intensity. For the circuit evaluation, a vibration sensor needs to be connected to a test chip because the input impedance is set low to improve charge transfer efficiency and the voltage signal generated by the charge transfer is affected by the vibration waveform. In addition, the VAM has a complex structure that is not regarded as a single rigid body, making it difficult to estimate the sensing performance. The proposed method solves this problem by simplifying the VAM simulation model using two parameters of the spring elements and extracting the parameters from a measured data point based on an independent relationship between the parameters. A test chip fabricated by using the 0.35-μm CMOS process detects a vibration at 40 Hz and 0.4 g with 0.7 nW, and the validity of the proposed method is confirmed via the consistency between the simulated results obtained based on the extracted parameters and the entire set of measured data. The design integration makes it possible to design sensing circuits that need the complex-structured sensor to be connected for evaluation.

本誌: 電気学会論文誌E（センサ・マイクロマシン部門誌） Vol.141 No.1 （2021） 特集：センサ・マイクロマシン英文特集号

本誌掲載ページ: 2023/07/13 p

原稿種別: 論文／英語

電子版へのリンク: https://www.jstage.jst.go.jp/article/ieejsmas/141/1/141_7/_article/-char/ja/