Fabrication of Tri-Axial MEMS Tactile Sensor for Minimally Invasive Medical Application using Wafer-Level Packaging
Fabrication of Tri-Axial MEMS Tactile Sensor for Minimally Invasive Medical Application using Wafer-Level Packaging
カテゴリ: 論文誌(論文単位)
グループ名: 【E】センサ・マイクロマシン部門
発行日: 2023/01/01
タイトル(英語): Fabrication of Tri-Axial MEMS Tactile Sensor for Minimally Invasive Medical Application using Wafer-Level Packaging
著者名: Tomoya Imanishi (Department of Mechanical Engineering, Graduate School of Engineering, Kobe University), Keiju Miyamoto (Department of Mechanical Engineering, Graduate School of Engineering, Kobe University), Shuntaro Higashi (Department of Mechanical Eng
著者名(英語): Tomoya Imanishi (Department of Mechanical Engineering, Graduate School of Engineering, Kobe University), Keiju Miyamoto (Department of Mechanical Engineering, Graduate School of Engineering, Kobe University), Shuntaro Higashi (Department of Mechanical Engineering, Graduate School of Engineering, Kobe University), Shunsuke Oki (Department of Mechanical Engineering, Graduate School of Engineering, Kobe University), Akio Uesugi (Department of Mechanical Engineering, Graduate School of Engineering, Kobe University), Koji Sugano (Department of Mechanical Engineering, Graduate School of Engineering, Kobe University), Takanori Aono (Department of Mechanical Engineering, Graduate School of Engineering, Kobe University), Yoshitada Isono (Department of Mechanical Engineering, Graduate School of Engineering, Kobe University)
キーワード: tactile sensor,wafer-level packaging,medical catheter,minimally invasive surgery
要約(英語): In this study, we successfully fabricated a minimum triaxial MEMS tactile sensor with a diameter of 320 μm for a medical catheter. The miniaturized sensor is expected to be installed onto the tip of the minimum guidewire to ensure a tactile sensor can be obtained to avoid an accident of breaking through blood vessel walls. After fabricating the detection unit and through-silicon via (TSV) unit, the two units were bonded using wafer-level gold-gold surface-activated bonding followed by clipping of the tactile sensor with a diameter of 320 μm. We confirmed that the proposed and optimized fabrication process realized an ultrasmall tactile sensor that can detect triaxial forces, which can be used in an advanced catheter system with a tactile-sensitive guidewire.
本誌: 電気学会論文誌E(センサ・マイクロマシン部門誌) Vol.143 No.1 (2023) 特集:センサ・マイクロマシン英文特集号
本誌掲載ページ: 13-18 p
原稿種別: 論文/英語
電子版へのリンク: https://www.jstage.jst.go.jp/article/ieejsmas/143/1/143_13/_article/-char/ja/
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