Multilayer Interconnection Structure for a Wearable Vibration Motor Array in Tactile-feedback Devices
Multilayer Interconnection Structure for a Wearable Vibration Motor Array in Tactile-feedback Devices
カテゴリ: 論文誌(論文単位)
グループ名: 【E】センサ・マイクロマシン部門
発行日: 2023/01/01
タイトル(英語): Multilayer Interconnection Structure for a Wearable Vibration Motor Array in Tactile-feedback Devices
著者名: Seiichi Takamatsu (The University of Tokyo), Katsuya Wakabayashi (The University of Tokyo), Junji Ohyama (National Institute of Advanced Industrial Science and Technology), Manabu Chikai (National Institute of Advanced Industrial Science and Technology),
著者名(英語): Seiichi Takamatsu (The University of Tokyo), Katsuya Wakabayashi (The University of Tokyo), Junji Ohyama (National Institute of Advanced Industrial Science and Technology), Manabu Chikai (National Institute of Advanced Industrial Science and Technology), Toshihiro Itoh (The University of Tokyo)
キーワード: vibration motor,e-textile,stretchable silver paste,multilayered circuit board structure
要約(英語): We propose a multilayered interconnection structure consisting of a textile, urethane film, and stretchable silver paste for tactile feedback. With this structure, we fabricated a prototype tactile-feedback device with an array of 10 vibration motors all wired under the same wiring resistance of 15 Ω within an area of 2.5×12 cm2. This prototype device provides tactile feedback in a virtual reality system.
本誌: 電気学会論文誌E(センサ・マイクロマシン部門誌) Vol.143 No.1 (2023) 特集:センサ・マイクロマシン英文特集号
本誌掲載ページ: 19-20 p
原稿種別: 研究開発レター/英語
電子版へのリンク: https://www.jstage.jst.go.jp/article/ieejsmas/143/1/143_19/_article/-char/ja/
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