Snリフローを適用したドーム型金型の加工プロセス

カテゴリ: 論文誌(論文単位)

グループ名: 【E】センサ・マイクロマシン部門

発行日: 2023/11/01

タイトル(英語): Fabricating Techniques of Dome-shaped Mold with Sn Reflow

著者名: 青野　宇紀（（株）日立製作所 研究開発グループ 生産・モノづくりイノベーションセンタ 信頼性科学研究部），金丸　昌敏（（株）日立製作所 研究開発グループ 生産・モノづくりイノベーションセンタ 信頼性科学研究部），吉村　保廣（（株）日立製作所 研究開発グループ 生産・モノづくりイノベーションセンタ 信頼性科学研究部）

著者名(英語): Takanori Aono (Reliability Science Research Department, Production Engineering and MONOZUKURI Innovation Center, Research & Development Group, Hitachi, Ltd.), Masatoshi Kanamaru (Reliability Science Research Department, Production Engineering and MONOZUKURI Innovation Center, Research & Development Group, Hitachi, Ltd.), Yasuhiro Yoshimura (Reliability Science Research Department, Production Engineering and MONOZUKURI Innovation Center, Research & Development Group, Hitachi, Ltd.)

キーワード: はんだ，リフロー，金型，転写，スズ電解めっき　　solder，reflow，mold tool，replicating，tin-electroplating

要約(英語): Recently, three-dimensional cell culture methods are focused on the fields of drug discovery and regenerative medicine. In the three-dimensional cell culture methods, cells are incubated to stereoscopic cellular structure (cellular spheroids) and metabolic organs, which are absorption tubes and excretory organs, are formed between cells. The metabolic organs are functional for drug metabolism in the tissue engineering. Conventional three-dimensional cell culture methods are used by nanoimprinted vessel, which are fabricated by a mold tool with Micro Electro Mechanical Systems (MEMS) processes, i. e. deposition, photolithography, and etching. Accordingly, the nanoimprinted vessels have very simple shapes, which are rectangular prism and cylinder. However, cells are not summarized in the center of the vessels, and the cellular spheroids are not efficiently incubated.This paper represents the fabricating method of dome-shaped vessels for efficient cell culture systems. In the three-dimensional cell culture, the dome-shaped vessels make it easy to collect the cells in the center of the vessels. However, the fabricating dome-shaped vessels are difficult to fabricate with only MEMS processes. To overcome this problem, the semiconductor post-process is applied to the fabricating process of dome-shaped vessels. The solder bump, which is connected between the semiconductor device and the external board, are easily formed to dome-shaped structure by reflow method. The dome-shaped mold tool, which solder bumps are plated on the substrate, is replicated to the resin.

本誌: 電気学会論文誌E（センサ・マイクロマシン部門誌） Vol.143 No.11 （2023） 特集：匂い・味に関するセンシングおよび提示技術

本誌掲載ページ: 372-376 p

原稿種別: 論文／日本語

電子版へのリンク: https://www.jstage.jst.go.jp/article/ieejsmas/143/11/143_372/_article/-char/ja/