ウエハレベルパッケージングを利用した薄型ひずみセンサの加工プロセス
ウエハレベルパッケージングを利用した薄型ひずみセンサの加工プロセス
カテゴリ: 論文誌(論文単位)
グループ名: 【E】センサ・マイクロマシン部門
発行日: 2024/04/01
タイトル(英語): Fabricating Process of Thin-Strain Sensor by Utilizing Wafer-Level-Packaging Techniques
著者名: 青野 宇紀((株)日立製作所 研究開発グループ),金丸 昌敏((株)日立製作所 研究開発グループ),池田 裕((株)日立製作所 研究開発グループ)
著者名(英語): Takanori Aono (Reliability Science Research Department, Production Engineering and MONOZUKURI Innovation Center, Research & Development Group, Hitachi, Ltd.), Masatoshi Kanamaru (Reliability Science Research Department, Production Engineering and MONOZUKURI Innovation Center, Research & Development Group, Hitachi, Ltd.), Hiroshi Ikeda (Reliability Science Research Department, Production Engineering and MONOZUKURI Innovation Center, Research & Development Group, Hitachi, Ltd.)
キーワード: ウエハレベルパッケージング,ひずみセンサ,研磨 wafer-level-packaging,strain-sensor,polishing
要約(英語): This research has developed a fabricating process of thin-strain sensor by utilizing wafer-level-packaging (WLP) techniques. The thickness of sensor makes thinner, its performance is able to highly increase. However, the thinner sensor was fragile, and so it was difficult to handle in post processes. Thus, a thin sensor with lid by utilizing WLP techniques, which is tough to break even when handled, is proposed in this research. More than 250-μm-deep grooves were fabricated around the lid by deep reactive ion etching. After the lid substrate was bonded on the sensor substrate with a resin, the sensor and lid substrates were respectively polished to 50 μm and 200 μm thickness. The lids were released along the grooves, and the 50-μm-thick strain sensors were able to be fabricated by utilizing WLP techniques. This sensor was used as a diaphragm to measure pressure. The sensors were assembled on a stainless steel housing without breakage. The performance of developed sensor was almost showed with a conventional pressure sensor.
本誌: 電気学会論文誌E(センサ・マイクロマシン部門誌) Vol.144 No.4 (2024)
本誌掲載ページ: 56-61 p
原稿種別: 論文/日本語
電子版へのリンク: https://www.jstage.jst.go.jp/article/ieejsmas/144/4/144_56/_article/-char/ja/
受取状況を読み込めませんでした
