Electromechanical coupling and damping effect of Capacitive Ultrasonic Micromachined Transducer

カテゴリ: 全国大会

論文No: 3-145

グループ名: 【全国大会】平成20年電気学会全国大会論文集

発行日: 2008/03/19

タイトル(英語): Electromechanical coupling and damping effect of Capacitive Ultrasonic Micromachined Transducer

著者名: 車 溥相(大阪大学),李 昇穆(IngenMSL),奥山 雅則(大阪大学)

著者名(英語): BuSang Cha(Osaka University),SeungMock Lee(IngenMSL),Masanori Okuyama(Osaka University)

キーワード: 電気機械結合係数|ダンピング効果

要約(日本語): The electromechanical coupling coefficient and damping coefficient have important effects on the performance of the CMUT, which determines the sensitivity and bandwidth of the CMUT. Therefore, for the optimal structure design and effective conversion efficiency of the CMUT device, the electromechanical coupling coefficient and damping coefficient on the transducer should be studied. In this study, we consider the relations between electromechanical coupling coefficient and the thin film membrane structure under the various conditions of air-gap height and membrane thickness. Also, the damping coefficients of the membrane at various etching hole ratios (10~90%) are investigated. The finite element method is used for the simulations, and those results are discussed in this study. It can be found from the result that electromechanical coupling coefficient is increased with decreasing the air-gap height. It is believed to be due to the higher fixed capacitance. The damping coefficient is decreased in the area-ratio range of 20 to 40% and with increasing the air-gap height. Finally, In order to achieve the optimal performance, we discuss the balance between the damping effect and the electromechanical coupling coefficient.

原稿種別: 日本語

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