Dielectric Behavior Analysis of Epoxy Resin Using Complex Electric Modulus

カテゴリ: 全国大会

論文No: 2-002

グループ名: 【全国大会】平成25年電気学会全国大会論文集

発行日: 2013/03/05

タイトル(英語): Dielectric Behavior Analysis of Epoxy Resin Using Complex Electric Modulus

著者名: Fuqiang Tian(Waseda University),Yoshimichi Ohki(Waseda University)

著者名(英語): Fuqiang Tian(Waseda University),Yoshimichi Ohki(Waseda University)

キーワード: 誘電特性|エポキシ樹脂|複素誘電率

要約(日本語): Dielectric behavior of epoxy resin under different temperatures and its dominating mechanism were analyzed using complex electric modulus. Complex permittivity results hardly clarify the dielectric behavior of epoxy resin, since the behavior is severely obscured by electrode polarization at high temperatures. However, the imaginary electric modulus shows a clear relaxation peak at temperatures above the glass transition temperature, which moves to a high frequency with an increase in temperature. The peak frequency fits the Arrhenius relation very well with an activation energy of about 1.2 eV, which is just the same for ac conduction. The Cole-Cole fit reveals that the relaxation process is close to a Debye type. The results indicate that electric modulus is more informative than dielectric permittivity as the electrode polarization at low frequencies at high temperatures can be suppressed. Both the dielectric relaxation and ac conduction are closely related to the molecular mobility and flexibility and are thermally activated above the glass transition temperature.

原稿種別: 日本語

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