Numerical Simulation on Temperature Distributoin in Ar/H2 Induction Thermal Plasma with Silicon Powder Injection

カテゴリ: 全国大会

論文No: 1-102

グループ名: 【全国大会】平成30年電気学会全国大会論文集

発行日: 2018/03/05

タイトル(英語): Numerical Simulation on Temperature Distributoin in Ar/H2 Induction Thermal Plasma with Silicon Powder Injection

著者名: Siregar Yulianta(Kanazawa University),Kodama Naoto(Kanazawa University),Tanaka Yasunori(Kanazawa University),Uesugi Yoshihiko(Kanazawa University),Ishijima Tatsuo(Kanazawa University)

著者名(英語): Siregar Yulianta(Kanazawa University),Kodama Naoto(Kanazawa University),Tanaka Yasunori(Kanazawa University),Uesugi Yoshihiko(Kanazawa University),Ishijima Tatsuo(Kanazawa University)

キーワード: inductively coupled thermal plasma (ICTP),Ar/H2 Induction Thermal Plasma,Silicon Powder Injection

要約(日本語): In nanopowder synthesis, feedstock powder is injected to be evaporated in the ICTP. Mixing of this evaporated materials to the ICTP markedly affects the thermodynamic properties and transport properties. These complex interactions between the ICTP and evaporation of feedstock is essential to be understood. In this report, we investigated thermal interactions between silicon (Si) feedstock powder and 99%Ar/1%H2 ICTP by the developed numerical model for Si nanopowder synthesis. The Si feedstock feed rate was set to 0, 0.1, 1.0 and 10 g/min. This implies that Si feeding more than 1 g/min may be too heavy to vaporize all feedstock injected.

原稿種別: 英語

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