薄膜型サーマルコンバータの安定性の改善

カテゴリ: 論文誌(論文単位)

グループ名: 【A】基礎・材料・共通部門

発行日: 2012/11/01

タイトル(英語): Improved Stability of a Thin-Film Multijunction Thermal Converter

著者名: 天谷　康孝（(独) 産業技術総合研究所），藤木　弘之（(独) 産業技術総合研究所），清水目　浩司（ニッコーム（株）），日高　滋（ニッコーム（株））

著者名(英語): Yasutaka Amagai (National Institute of Advanced Industrial Science and Technology), Hiroyuki Fujiki (National Institute of Advanced Industrial Science and Technology), Koji Shimizume (Nikkohm Co. Ltd.), Shigeru Hidaka (Nikkohm Co. Ltd.)

キーワード: 薄膜型サーマルコンバータ，安定性，電気計測，交流電圧標準，交直変換標準　　thin-film multijunction thermal converter，stability，electrical variables measurements，AC voltage standard，AC-DC transfer standard

要約(英語): We have developed a high-performance thin-film multijunction thermal converter (TMJTC) with improved stability, and evaluated its frequency property, long-term stability, and environmental property using high-precision AC-DC transfer difference comparator system. We have fabricated a TMJTC with improved deposit pattern of a Bi-Sb-Cu based thin-film thermopile to avoid interface delamination between Bi and Cu layers. Our TMJTC shows good frequency property, which is less than 5μV/V in the range from 10Hz to 100kHz at the root mean squared (rms) voltage of 10V. The long-term stability has been significantly increased due to our thin-film thermopile compared with that of previously fabricated TMJTC, which is less than 2μV/V for 18 months at room temperature. We have also evaluated the temperature, relative humidity, and pressure property based on the International Electrotechnical Commission (IEC) standards for electronic devices. The measurement results have shown that the dependence of the AC-DC transfer difference on the temperature, humidity, and the pressure is less than 1μV/V, which can be comparable to those of thermal converters as the primary standard.

本誌: 電気学会論文誌A（基礎・材料・共通部門誌） Vol.132 No.11 （2012） 特集：放電現象・新素材とその応用技術

本誌掲載ページ: 1011-1017 p

原稿種別: 論文／日本語

電子版へのリンク: https://www.jstage.jst.go.jp/article/ieejfms/132/11/132_1011/_article/-char/ja/