大電流スイッチギヤを実現する高熱伝導エポキシ複合体の開発

カテゴリ: 論文誌(論文単位)

グループ名: 【A】基礎・材料・共通部門

発行日: 2017/03/01

タイトル(英語): Development of High Thermal Conductive Epoxy Composite for Large Current Switchgear

著者名: 小宮　玄（（株）東芝），今井　隆浩（（株）東芝），宮内　康寿（（株）東芝）

著者名(英語): Gen Komiya (Toshiba Corporation), Takahiro Imai (Toshiba Corporation), Yasuhisa Miyauchi (Toshiba Corporation)

キーワード: エポキシ複合体，固体絶縁スイッチギヤ，熱伝導率，線膨張率　　epoxy composite，solid insulated switchgear，thermal conductivity，thermal expansion coefficient

要約(英語): Toshiba has developed solid insulated switchgear (SIS) which insulates the main circuit with epoxy composites. The solid insulating system is able not only to use no SF6, which is a kind of global warming gas, but also to supply compact equipment. In SIS, heat generated by the current loss in the conductors is dissipated through the epoxy composite. Therefore, development of high thermal conductive epoxy composites has been desired with respect to large current class SIS such as 2500 A. In this paper, epoxy composite was filled with MgO having high thermal conductivity and SiO2 having low thermal expansion coefficient. The result of temperature rise analysis of 40.5 kV - 2500 A SIS demonstrated that the high thermal conductive epoxy composite reduced rising temperature by approximately 10 K compared to conventional epoxy composite.

本誌: 電気学会論文誌A（基礎・材料・共通部門誌） Vol.137 No.3 （2017）

本誌掲載ページ: 178-183 p

原稿種別: 論文／日本語

電子版へのリンク: https://www.jstage.jst.go.jp/article/ieejfms/137/3/137_178/_article/-char/ja/