Sorting-Based I/O Connection Assignment and Non-Manhattan RDL Routing for Flip-Chip Designs

カテゴリ: 論文誌(論文単位)

グループ名: 【C】電子・情報・システム部門

発行日: 2015/12/01

タイトル(英語): Sorting-Based I/O Connection Assignment and Non-Manhattan RDL Routing for Flip-Chip Designs

著者名: Ran Zhang (Graduate School of Information, Production and Systems, Waseda University), Takahiro Watanabe (Graduate School of Information, Production and Systems, Waseda University)

著者名(英語): Ran Zhang (Graduate School of Information, Production and Systems, Waseda University), Takahiro Watanabe (Graduate School of Information, Production and Systems, Waseda University)

キーワード: I/O connection assignment，RDL routing，flip-chip designs

要約(英語): In modern VLSI designs, a flip-chip package is widely used to meet the higher integration density and the larger I/O counts of circuits. Recently the I/O buffers are mapped onto bump balls without changing the module placement using re-distribution layer (RDL) in flip-chip designs. In this research, a sorting-based I/O connection assignment and non-Manhattan RDL routing method is proposed for area I/O flip-chip designs. The approach initially assigns the I/O buffers to bump balls by sorting the Manhattan distance between them. Three kinds of pair-exchange procedures are then carried out to improve the initial assignment. Then to shorten the wire length, non-Manhattan RDL routing is adopted to connect the I/O buffers and bump balls. Finally some un-routed connections are ripped up and rerouted. The experimental results show that the proposed method is able to obtain the routes with shorter wire length in reasonable CPU times.

本誌: 電気学会論文誌C（電子・情報・システム部門誌） Vol.135 No.12 （2015） 特集：電気・電子・情報関係学会東海支部連合大会

本誌掲載ページ: 1535-1544 p

原稿種別: 論文／英語

電子版へのリンク: https://www.jstage.jst.go.jp/article/ieejeiss/135/12/135_1535/_article/-char/ja/