半導体オーバレイ用SEM評価点の自動抽出技術

カテゴリ: 論文誌(論文単位)

グループ名: 【C】電子・情報・システム部門

発行日: 2018/10/01

タイトル(英語): Automatic Extraction Technique of CD-SEM Evaluation Points to Measure Semiconductor Overlay Error

著者名: 宮本　敦（（株）日立製作所 研究開発グループ），川原　敏一（（株）日立ハイテクノロジーズ）

著者名(英語): Atsushi Miyamoto (Hitachi, Ltd., Research & Development Group), Toshikazu Kawahara (Hitachi High-Technologies Corporation)

キーワード: 走査電子顕微鏡，オーバレイ計測，設計データ，自動化　　scanning electron microscope (SEM)，overlay measurement，design data，automation

要約(英語): In semiconductor device manufacturing process, it is necessary to measure overlay error between integrated layers. As semiconductor process design rules continue to shrink, small overlay error comes to lead to the fatal fault of the device electrical property. As a result, the needs for the dense overlay measurement in the chip with the use of circuit pattern increase. We propose an automatic extraction technique of the evaluated points (EPs) that are suitable for the overlay measurement by scanning electron microscopy (SEM) using design data of the device pattern layout. The proposed algorithm extracts all measureable patterns by evaluation of the positional relationship between a segment pair on the upper and lower layers by plural selection indices. Simulation was performed to estimate the overlay error distribution within the shot area using the EPs automatically extracted by the proposed method. The standard deviation of estimation errors in the x- and y-directions were 0.06 nm and 0.10 nm (3σ), respectively. It was confirmed that distortion in the exposure apparatus can be estimated automatically and highly accurately.

本誌: 電気学会論文誌C（電子・情報・システム部門誌） Vol.138 No.10 （2018） 特集：2017電気関係学会四国支部連合大会

本誌掲載ページ: 1278-1286 p

原稿種別: 論文／日本語

電子版へのリンク: https://www.jstage.jst.go.jp/article/ieejeiss/138/10/138_1278/_article/-char/ja/