電気的接続を伴うLTCC基板とSi基板との陽極接合

カテゴリ: 論文誌(論文単位)

グループ名: 【E】センサ・マイクロマシン部門

発行日: 2011/05/01

タイトル(英語): Anodic Bonding between LTCC Substrate and Si Substrate with Electrical Connections

著者名: 松崎　栄（東北大学マイクロシステム融合研究開発センター），田中　秀治（東北大学大学院工学研究科／東北大学マイクロシステム融合研究開発センター），江刺　正喜（東北大学マイクロシステム融合研究開発センター／東北大学大学院工学研究科）

著者名(英語): Sakae Matsuzaki (Micro System Integration Center (μSIC), Tohoku University), Shuji Tanaka (Department of Nanomechanics, Graduate School of Engineering, Tohoku University/Micro System Integration Center (μSIC), Tohoku University), Masayoshi Esashi (Micro System Integration Center (μSIC), Tohoku University/Department of Nanomechanics, Graduate School of Engineering, Tohoku University)

キーワード: 陽極接合，電気接続，金属接合，パッケージング，LTCC　　Anodic bonding，Electrical connection，Metal bonding，Packaging，LTCC

要約(英語): This paper describes metal-metal electrical connection simultaneously established with anodic bonding between a LTCC (low temperature cofired ceramic) substrate and a Si substrate. Metal pads are composed of Sn on Cu. Sn melts during anodic bonding, absorbing the height margin of the metal pads to ensure good contact between the LTCC substrate and the Si substrate. This study first investigated formic acid vapor treatment before anodic bonding to remove an oxide layer on the Sn surface. The removal of the oxide layer proceeds at a process temperature of 150℃ or higher. By the treatment at 250℃, the surface of the Sn layer is smoothed due to reflow effect, but the multilayer structure of the metal pads does not significantly change after 5 min treatment. The bonded metal pad is almost uniform in both structure and composition throughout its thickness. The composition of the bonded metal pads is approximately Sn : Cu = 1 : 1 in atomic ratio, and might have a remelting temperature of ca. 415℃, which is much higher than a reflow temperature in device mounting process.

本誌: 電気学会論文誌E（センサ・マイクロマシン部門誌） Vol.131 No.5 （2011）

本誌掲載ページ: 189-194 p

原稿種別: 論文／日本語

電子版へのリンク: https://www.jstage.jst.go.jp/article/ieejsmas/131/5/131_5_189/_article/-char/ja/