High-Throughput UV Nanoimprint Process Using Flexible Resin Mold for High-Brightness Light-Emitting Diodes

カテゴリ: 論文誌(論文単位)

グループ名: 【E】センサ・マイクロマシン部門

発行日: 2012/08/01

タイトル(英語): High-Throughput UV Nanoimprint Process Using Flexible Resin Mold for High-Brightness Light-Emitting Diodes

著者名: Hidetoshi Shinohara (Toshiba Machine Co., Ltd.), Takaharu Tashiro (Toshiba Machine Co., Ltd.), Takafumi Ookawa (Toshiba Machine Co., Ltd.), Hiromi Nishihara (Toshiba Machine Co., Ltd.)

著者名(英語): Hidetoshi Shinohara (Toshiba Machine Co., Ltd.), Takaharu Tashiro (Toshiba Machine Co., Ltd.), Takafumi Ookawa (Toshiba Machine Co., Ltd.), Hiromi Nishihara (Toshiba Machine Co., Ltd.)

キーワード: UV nanoimprinting，resin mold，light emitting diodes

要約(英語): This paper demonstrated a high-throughput fabrication process of resin mold and nanostructures for high-brightness light-emitting diodes (LED). The fabrication process includes roll-to-roll (RtR) UV imprinting for resin mold fabrication and perpendicular UV imprinting on wafers. The measurement results of pattern sizes in UV imprinted sample indicate that the resin mold was uniform enough to use for subsequent UV imprinting, and highly uniform UV imprinting was achieved by means of developed high-throughput UV imprinting equipment. Thickness of the residual layer was highly uniform and repeatable. This fabrication process is expected to be applied to fabricate nanostructures for actual high-brightness LEDs.

本誌: 電気学会論文誌E（センサ・マイクロマシン部門誌） Vol.132 No.8 （2012） 特集：MEMS パッケージングと微細加工技術

本誌掲載ページ: 235-239 p

原稿種別: 論文／英語

電子版へのリンク: https://www.jstage.jst.go.jp/article/ieejsmas/132/8/132_235/_article/-char/ja/