HR (High-Resolution) 積分法を用いた高感度リーク検出法の研究

カテゴリ: 論文誌(論文単位)

グループ名: 【E】センサ・マイクロマシン部門

発行日: 2012/08/01

タイトル(英語): High-sensitivity Leak-testing Method with High-Resolution Integration Technique

著者名: 藤吉　基弘（（株）豊田中央研究所），野々村　裕（（株）豊田中央研究所），千田　英美（トヨタ自動車（株））

著者名(英語): Motohiro Fujiyoshi (Toyota Central R&D Labs., Inc.), Yutaka Nonomura (Toyota Central R&D Labs., Inc.), Hidemi Senda (Toyota Motor Corporation)

キーワード: リーク検出法，リーク量，ヘリウムガス，センサパッケージ，質量分析器　　leak-testing method，leak-rate，helium gas，sensor package，mass spectrometer

要約(英語): A high-resolution leak-testing method named HR (High-Resolution) Integration Technique has been developed for MEMS (Micro Electro Mechanical Systems) sensors such as a vibrating angular-rate sensor housed in a vacuum package. Procedures of the method to obtain high leak-rate resolution were as follows. A package filled with helium gas was kept in a small accumulation chamber to accumulate helium gas leaking from the package. After the accumulation, the accumulated helium gas was introduced into a mass spectrometer in a short period of time, and the flux of the helium gas was measured by the mass spectrometer as a transient phenomenon. The leak-rate of the package was calculated from the detected transient waveform of the mass spectrometer and the accumulation time of the helium gas in the accumulation chamber. Because the density of the helium gas in the vacuum chamber increased and the accumulated helium gas was measured in a very short period of time with the mass spectrometer, the peak strength of the transient waveform became high and the signal to noise ratio was much improved.The detectable leak-rate resolution of the technique reached 1×10-15 (Pa・m3/s). This resolution is 103 times superior to that of the conventional helium vacuum integration method. The accuracy of the measuring system was verified with a standard helium gas leak source. The results were well matched between theoretical calculation based on the leak-rate of the source and the experimental results within only 2% error.

本誌: 電気学会論文誌E（センサ・マイクロマシン部門誌） Vol.132 No.8 （2012） 特集：MEMS パッケージングと微細加工技術

本誌掲載ページ: 240-245 p

原稿種別: 論文／日本語

電子版へのリンク: https://www.jstage.jst.go.jp/article/ieejsmas/132/8/132_240/_article/-char/ja/