Nanoporous Gold for MEMS Packing Applications
Nanoporous Gold for MEMS Packing Applications
カテゴリ: 論文誌(論文単位)
グループ名: 【E】センサ・マイクロマシン部門
発行日: 2013/02/01
タイトル(英語): Nanoporous Gold for MEMS Packing Applications
著者名: Yu-Ching Lin (WPI-AIMR, Tohoku University), Wei-Shan Wang (Micro System Integration Center, Tohoku University), Lu Yang Chen (WPI-AIMR, Tohoku University), Ming Wei Chen (WPI-AIMR, Tohoku University), Thomas Gessner (Fraunhofer ENAS and Chemnitz Universit
著者名(英語): Yu-Ching Lin (WPI-AIMR, Tohoku University), Wei-Shan Wang (Micro System Integration Center, Tohoku University), Lu Yang Chen (WPI-AIMR, Tohoku University), Ming Wei Chen (WPI-AIMR, Tohoku University), Thomas Gessner (Fraunhofer ENAS and Chemnitz University of Technology), Masayoshi Esashi (WPI-AIMR, Tohoku University)
キーワード: MEMS packaging,nanoporous gold,anodic bonding,LTCC,low temperature bonding
要約(英語): On-chip nanoporous gold (NPG) fabrication has been successfully developed by Au-Sn alloys electrodeposition and dealloying process, to use its compressible body and nanostructured surface for micro electro mechanical systems (MEMS) applications. Anodically-bondable low temperature cofired ceramic (LTCC) substrates are proposed to provide electrical connective packaging by using novel nano-structured gold. The porous structure offers sponge-like functions which forms electrical contacts as well during anodic bonding. Nanoporous gold with porosity in nanoscale indicates a highly reactive surface which makes it possible to be a promising candidate for bonding process to reduce the bonding temperature. Low temperature bonding has been achieved by using nanoporous gold. These encouraging results imply good possibilities of nanoporous gold for MEMS packaging applications.
本誌: 電気学会論文誌E(センサ・マイクロマシン部門誌) Vol.133 No.2 (2013)
本誌掲載ページ: 31-36 p
原稿種別: 論文/英語
電子版へのリンク: https://www.jstage.jst.go.jp/article/ieejsmas/133/2/133_31/_article/-char/ja/
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