商品情報にスキップ
1 1

Fabrication of Narrow-gapped Dual Si AFM Tips by Mechanically Polishing-back for Selective Trench Sidewalls Protection

Fabrication of Narrow-gapped Dual Si AFM Tips by Mechanically Polishing-back for Selective Trench Sidewalls Protection

通常価格 ¥770 JPY
通常価格 セール価格 ¥770 JPY
セール 売り切れ
税込

カテゴリ: 論文誌(論文単位)

グループ名: 【E】センサ・マイクロマシン部門

発行日: 2014/04/01

タイトル(英語): Fabrication of Narrow-gapped Dual Si AFM Tips by Mechanically Polishing-back for Selective Trench Sidewalls Protection

著者名: Kenta Kawashima (Graduate school of Science and Engineering, Yamagata University), Eiji Makino (Graduate school of Science and Technology, Hirosaki University), Takashi Mineta (Graduate school of Science and Engineering, Yamagata University)

著者名(英語): Kenta Kawashima (Graduate school of Science and Engineering, Yamagata University), Eiji Makino (Graduate school of Science and Technology, Hirosaki University), Takashi Mineta (Graduate school of Science and Engineering, Yamagata University)

キーワード: dual AFM tip,narrow gap,self-alignment,trench sidewall protection,mechanical polishing-back

要約(英語): We developed a fabrication process of narrow-gapped twin nano-tips for atomic force microscopy (AFM) dual probes. A tetrahedral dual tip consisting of an inclined crystalline Si (111) plane and two dry-etched vertical planes was fabricated using deep reactive ion etching (D-RIE) to form a (110)-oriented narrow trench, thermal oxidation and additively refilling the trench with resin to protect the sidewalls, mechanically polishing-back the top resin and SiO2 layers to expose the Si (100) surface, and anisotropically etching the crystalline Si to form the (111) plane. The mechanically polished SiO2 thin film and resin layer were used to protect the trench sidewalls thereby preventing the gap between the Si tips from widening because of oxidation. A dual tip with a 450 nm gap was obtained by using the fabrication process. In addition to protecting the Si sidewalls with a SiO2 thin film, the resin refilling prevented abrasive particles from penetrating into the trench.

本誌: 電気学会論文誌E(センサ・マイクロマシン部門誌) Vol.134 No.4 (2014)

本誌掲載ページ: 74-78 p

原稿種別: 論文/英語

電子版へのリンク: https://www.jstage.jst.go.jp/article/ieejsmas/134/4/134_74/_article/-char/ja/

販売タイプ
書籍サイズ
ページ数
詳細を表示する