Design and Fabrication of On-Chip Micro-Thermoelectric Cooler Based on Electrodeposition Process

カテゴリ: 論文誌(論文単位)

グループ名: 【E】センサ・マイクロマシン部門

発行日: 2020/01/01

タイトル(英語): Design and Fabrication of On-Chip Micro-Thermoelectric Cooler Based on Electrodeposition Process

著者名: Jirath Enju (Department of Mechanical Systems Engineering, Tohoku University/Micro System Integration Center, Tohoku University), Nguyen Huu Trung (Department of Mechanical Systems Engineering, Tohoku University/Micro System Integration Center, Tohoku Uni

著者名(英語): Jirath Enju (Department of Mechanical Systems Engineering, Tohoku University/Micro System Integration Center, Tohoku University), Nguyen Huu Trung (Department of Mechanical Systems Engineering, Tohoku University/Micro System Integration Center, Tohoku University), Samat Khairul Fadzli (Department of Mechanical Systems Engineering, Tohoku University/Micro System Integration Center, Tohoku University), Po-Hung Chen (Department of Mechanical Systems Engineering, Tohoku University/Micro System Integration Center, Tohoku University), Takahito Ono (Department of Mechanical Systems Engineering, Tohoku University/Micro System Integration Center, Tohoku University)

キーワード: micro-cooler，thermoelectric materials，electrochemical deposition

要約(英語): Micro-thermoelectric coolers (μ-TECs) using thermoelectric materials n-type Bismuth Telluride (Bi2Te3), p-type Antimony Telluride (Sb2Te3), and Platinum Bismuth Telluride (Pt/Bi2Te3) composite are designed, and the fabrication process of the prototype is developed. A silicon cooling stage is supported by surrounding thermoelectric legs of the n-type and p-type materials. The thermoelectric films are grown by using electrochemical deposition because of the ability to deposit thick films and the compatibility with microfabrication process. Two types of specific designs with different numbers of thermoelectric legs are considered, and their individual performance is calculated using material parameters of the electrodeposited thermoelectric materials. The calculation shows 0.46-0.52 of the maximum coefficient of performance (COPmax) and 18-26 K of maximum cooling temperature under small current supply. Fabrication process for the chip-scale cooling device is thus developed.

本誌: 電気学会論文誌E（センサ・マイクロマシン部門誌） Vol.140 No.1 （2020） 特集：センサ・マイクロマシン英文特集号

本誌掲載ページ: 18-23 p

原稿種別: 論文／英語

電子版へのリンク: https://www.jstage.jst.go.jp/article/ieejsmas/140/1/140_18/_article/-char/ja/