Problems in Fabrication of Metal Pads for Capacitive MEMS Using Hands-on Open Facility

カテゴリ: 論文誌(論文単位)

グループ名: 【E】センサ・マイクロマシン部門

発行日: 2022/09/01

タイトル(英語): Problems in Fabrication of Metal Pads for Capacitive MEMS Using Hands-on Open Facility

著者名: Linxin Zhang (Department of Robotics, Tohoku University), Takashiro Tsukamoto (Department of Robotics, Tohoku University), Shuji Tanaka (Department of Robotics, Tohoku University)

著者名(英語): Linxin Zhang (Department of Robotics, Tohoku University), Takashiro Tsukamoto (Department of Robotics, Tohoku University), Shuji Tanaka (Department of Robotics, Tohoku University)

キーワード: metal pad fabrication，problem in common facility，contact resistance，adhesion

要約(英語): Metal deposition is one of the important fabrication process for the electrical wires as well as bonding pads in micrelectromechanical systems (MEMS). For the development of MEMS devices, especially in university, common facilities are sometimes used. The machine conditions in such the facility are uncontrollable, therefore the properties of deposited film are unstable. In this paper, problems of contact resistance as well as adhesion using the shared machine were reported. Finally, a method to improve the film quality using such the machine was proposed. This information is important for the MEMS device development using the hand-on facilities.

本誌: 電気学会論文誌E（センサ・マイクロマシン部門誌） Vol.142 No.9 （2022） 特集：次世代社会基盤を支えるIoT，センシングシステムのための要素技術

本誌掲載ページ: 220-223 p

原稿種別: 論文／英語

電子版へのリンク: https://www.jstage.jst.go.jp/article/ieejsmas/142/9/142_220/_article/-char/ja/