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Review of Magnetic Resonance Force Sensors Based on Nanomechanical Cantilever

Review of Magnetic Resonance Force Sensors Based on Nanomechanical Cantilever

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カテゴリ: 論文誌(論文単位)

グループ名: 【E】センサ・マイクロマシン部門

発行日: 2022/09/01

タイトル(英語): Review of Magnetic Resonance Force Sensors Based on Nanomechanical Cantilever

著者名: Masaya Toda (Graduate School of Engineering, Tohoku University), Gaopeng Xue (School of Mechanical Engineering and Automation, Harbin Institute of Technology), Takahito Ono (Graduate School of Engineering, Tohoku University/Micro System Integration Center

著者名(英語): Masaya Toda (Graduate School of Engineering, Tohoku University), Gaopeng Xue (School of Mechanical Engineering and Automation, Harbin Institute of Technology), Takahito Ono (Graduate School of Engineering, Tohoku University/Micro System Integration Center, Tohoku University)

キーワード: magnetic resonance,cantilever,force sensing,MRI

要約(英語): Three-dimensional force distribution based on magnetic resonance in microsamples can be obtained by Si nanomechanical cantilevers with a magnet. Highly sensitive magnetic sensors require operation under high-Q, high-vacuum conditions. To overcome the limitation of operation in vacuum conditions, a force sensor for magnetic resonance detection with a vacuum-sealed magnetic cantilevers was developed. A silicon-based cantilever with a magnet particle was enclosed in a vacuum chamber using anodic-bonding and direct metal (Sn-Al) bonding. The proposed vacuum sealed magnet-based cantilever has confirmed the high feasibility of magnetic resonance force detection within a non-hermetic environment. The fabrication process of mounting the magnets one by one is undesirable in terms of manufacturing cost. Compared to other deposition methods, the electroplating method of magnetic material can produce thicker magnetic films and lower production costs. On the other hand, force detection with sensors with high Q-factor has a long response time. In order to reduce the measurement time, we proposed a two-dimensional force transducer with Si thin wires assembled on a glass trench and a bridge resonator including a field-effect transistor.

本誌: 電気学会論文誌E(センサ・マイクロマシン部門誌) Vol.142 No.9 (2022) 特集:次世代社会基盤を支えるIoT,センシングシステムのための要素技術

本誌掲載ページ: 224-229 p

原稿種別: 論文/英語

電子版へのリンク: https://www.jstage.jst.go.jp/article/ieejsmas/142/9/142_224/_article/-char/ja/

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